Improvement of Resistive Switching Properties in ZrO2-Based ReRAM With Implanted Ti Ions
QI LIU, SHIBING LONG, WEI WANG, QINGYUN ZUO, SEN ZHANG, JUNNING CHEN, MING LIU
Published in IEEE electron device letters (01.12.2009)
Published in IEEE electron device letters (01.12.2009)
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Wang, Yan, Lv, Hangbing, Wang, Wei, Liu, Qi, Long, Shibing, Wang, Qin, Huo, Zongliang, Zhang, Sen, Li, Yingtao, Zuo, Qingyun, Lian, Wentai, Yan, Jianhong, Liu, Ming
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Published in IEEE electron device letters (01.04.2010)
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Development and characterization of TaN thin film resistor with CMOS compatible fabrication process
Xiaoxu Kang, Limin Zhu, Xingwang Zhu, Qingyun Zuo, Xiaolan Zhong, Shoumian Chen, Yuhang Zhao, Shanshan Liu, Hanwei Lu, Jianmin Wang, Wei Wang, Bo Zhang
Published in 2017 IEEE 12th International Conference on ASIC (ASICON) (01.10.2017)
Published in 2017 IEEE 12th International Conference on ASIC (ASICON) (01.10.2017)
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Conference Proceeding
Improvement of Resistive Switching Properties in \hbox-Based ReRAM With Implanted Ti Ions
Liu, Qi, Long, Shibing, Wang, Wei, Zuo, Qingyun, Zhang, Sen, Chen, Junning, Liu, Ming
Published in IEEE electron device letters (01.12.2009)
Published in IEEE electron device letters (01.12.2009)
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Humidity sensor with graphene oxide as sensing material
Xiaoxu Kang, Qingyun Zuo, Chao Yuan, Weijun Wang, Meng Gao, Liangliang Jiang, Yongxing Zhou, Yong Wang, Shoumian Chen, Yuhang Zhao, Jia Liu, Wenjie Sheng, Jia Zhou
Published in 2015 IEEE 11th International Conference on ASIC (ASICON) (01.11.2015)
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Xiaoxu Kang, Qingyun Zuo, Jiaqing Li, Chao Yuan, Yuhang Zhao
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Published in 2011 9th IEEE International Conference on ASIC (01.10.2011)
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Fabrication of silicon-based MEMS capacitive microphone structure with thin starting wafer
Xiaoxu Kang, Chao Yuan, Qingyun Zuo, Changwa Yao, Shoumian Chen, Yuhang Zhao, Yilin Yan, Yuanjun Xu, Weiping Zhou
Published in 2013 IEEE 10th International Conference on ASIC (01.10.2013)
Published in 2013 IEEE 10th International Conference on ASIC (01.10.2013)
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Investigation of resistive switching in Cu-doped HfO2 thin film for multilevel non-volatile memory applications
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Molecular characterization of the B lymphocyte-induced maturation protein-1 (blimp1) gene of common carp (Cyprinus carpio) and its transcription repression involves recruitment of histone deacetylase HDAC3
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Application of graphene sheet as intermediate heat spreading layer in LED modules
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Published in 2016 13th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT) (01.10.2016)
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Published in 2016 China Semiconductor Technology International Conference (CSTIC) (01.03.2016)
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Conference Proceeding
MEMS micro-bridge structure-based process platform fabricated with CMOS Al BEOL compatible process
Kang, Xiaoxu, Zhong, Xiaolan, Shen, Ruoxi, Zuo, Qingyun, Li, Ming, Chen, Shoumian, Zhao, Yuhang, Zhu, Xingwang, Zhu, Limin, Liu, Shanshan, Wang, Jianmin, Lu, Hanwei, Wang, Wei, Ye, Zijing, Wang, Jianpeng, Zhang, Bo
Published in Japanese Journal of Applied Physics (01.07.2019)
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Published in 2012 IEEE International Conference on Electron Devices and Solid State Circuit (EDSSC) (01.12.2012)
Published in 2012 IEEE International Conference on Electron Devices and Solid State Circuit (EDSSC) (01.12.2012)
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Conference Proceeding
Cu/Airgap integration on 90nm Cu BEOL process platform
Xiaoxu Kang, Qingyun Zuo, Xinxue Wang, Shaohai Zeng, Shoumian Chen
Published in 2012 IEEE 11th International Conference on Solid-State and Integrated Circuit Technology (01.10.2012)
Published in 2012 IEEE 11th International Conference on Solid-State and Integrated Circuit Technology (01.10.2012)
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Conference Proceeding
Research on DTN Based Interconnecting ZigBee Network Techniques
Liu Xinyu, Li Bing, Chen Ming, Wang Xiulei, Zou Qingyun
Published in 2011 7th International Conference on Wireless Communications, Networking and Mobile Computing (01.09.2011)
Published in 2011 7th International Conference on Wireless Communications, Networking and Mobile Computing (01.09.2011)
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Conference Proceeding