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"ZUNIGA-ORTIZ EDGAR R"
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"ZUNIGA-ORTIZ EDGAR R"
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Bumpless Chip Scale Device (CSP) and board assembly
by
Zuniga
-
Ortiz
,
Edgar R
,
Koduri, Sreenivasan K
Year of Publication
28.04.2021
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Microelectromechanical system having movable element integrated into substrate-based package
by
ZUNIGA
-
ORTIZ EDGAR R
,
KRENIK WILLIAM R
Year of Publication
11.02.2014
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MICROELECTROMECHANICAL SYSTEM HAVING MOVABLE ELEMENT INTEGRATED INTO SUBSTRATE-BASED PACKAGE
by
ZUNIGA
-
ORTIZ EDGAR R
,
KRENIK WILLIAM R
Year of Publication
14.03.2013
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Bumpless wafer scale device and board assembly
by
Zuniga
-
Ortiz
,
Edgar R
,
Koduri, Sreenivasan K
Year of Publication
22.03.2011
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Bumpless wafer scale device and board assembly
by
ZUNIGA
-
ORTIZ EDGAR R
,
KODURI SREENIVASAN K
Year of Publication
22.03.2011
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SEMICONDUCTOR DEVICE HAVING POST-MOLD NICKEL/PALLADIUM/GOLD PLATED LEADS
by
ABBOTT, DONALD, C
,
ZUNIGA
-
ORTIZ
,
EDGAR
,
R
Year of Publication
02.10.2008
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Semiconductor device having post-mold nickel/palladium/gold plated leads
by
Abbott, Donald C
,
Zuniga
-
Ortiz
,
Edgar R
Year of Publication
06.05.2008
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Semiconductor device having post-mold nickel/palladium/gold plated leads
by
ZUNIGA
-
ORTIZ EDGAR R
,
ABBOTT DONALD C
Year of Publication
06.05.2008
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Semiconductor Device Having Post-Mold Nickel/Palladium/Gold Plated Leads
by
ZUNIGA
-
ORTIZ EDGAR R
,
ABBOTT DONALD C
Year of Publication
22.11.2007
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Hard disk drive preamp heat dissipation methods
by
GLOVER KERRY C
,
ZUNIGA
-
ORTIZ EDGAR R
Year of Publication
25.10.2007
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Semiconductor device having post-mold nickel/palladium/gold plated leads
by
Abbott, Donald C
,
Zuniga
-
Ortiz
,
Edgar R
Year of Publication
11.09.2007
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Semiconductor device having post-mold nickel/palladium/gold plated leads
by
ZUNIGA
-
ORTIZ EDGAR R
,
ABBOTT DONALD C
Year of Publication
11.09.2007
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Method for efficient annealing of plated semiconductor package leads
by
ZUNIGA
-
ORTIZ EDGAR R
,
KODURI SREENIVASAN K
Year of Publication
24.08.2006
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Semiconductor device and method of fabricating a semiconductor assembly
by
KODURI, SREENIVASAN K
,
ZUNIGA
-
ORTIZ
,
EDGAR R
Year of Publication
07.06.2006
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SEMICONDUCTOR DEVICE HAVING POST-MOLD NICKEL/PALLADIUM/GOLD PLATED LEADS
by
ABBOTT, DONALD, C
,
ZUNIGA
-
ORTIZ
,
EDGAR
,
R
Year of Publication
18.05.2006
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Semiconductor device having post-mold nickel/palladium/gold plated leads
by
ZUNIGA
-
ORTIZ EDGAR R
,
ABBOTT DONALD C
Year of Publication
11.05.2006
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17
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Flip-chip without bumps and polymer for board assembly
by
ZUNIGA
-
ORTIZ EDGAR R
,
KODURI SREENIVASAN K
Year of Publication
12.01.2006
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Bumpless wafer scale device and board assembly
by
ZUNIGA
-
ORTIZ EDGAR R
,
KODURI SREENIVASAN K
Year of Publication
04.08.2005
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Flip-chip without bumps and polymer for board assembly
by
Zuniga
-
Ortiz
,
Edgar R
,
Koduri, Sreenivasan K
Year of Publication
05.07.2005
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Flip-chip without bumps and polymer for board assembly
by
ZUNIGA
-
ORTIZ EDGAR R
,
KODURI SREENIVASAN K
Year of Publication
05.07.2005
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