Microstructure in copper interconnects – Influence of plating additive concentration
Neuner, Jürgen, Zienert, Inka, Peeva, Anita, Preuße, Axel, Kücher, Peter, Bartha, Johann W.
Published in Microelectronic engineering (01.03.2010)
Published in Microelectronic engineering (01.03.2010)
Get full text
Journal Article
Conference Proceeding
Nanotwin formation and its physical properties and effect on reliability of copper interconnects
Xu, Di, Sriram, Vinay, Ozolins, Vidvuds, Yang, Jenn-Ming, Tu, K.N., Stafford, Gery R., Beauchamp, Carlos, Zienert, Inka, Geisler, Holm, Hofmann, Petra, Zschech, Ehrenfried
Published in Microelectronic engineering (01.10.2008)
Published in Microelectronic engineering (01.10.2008)
Get full text
Journal Article
Conference Proceeding
Process Control and Physical Failure Analysis for Sub-100NM CU/Low-K Structures
Zschech, Ehrenfried, Huebner, Rene, Potapov, Pavel, Zienert, Inka, Meyer, Moritz Andreas, Chumakov, Dmytro, Geisler, Holm, Hecker, Michael, Engelmann, Hans-Juergen, Langer, Eckhard
Published in 2008 International Interconnect Technology Conference (01.06.2008)
Published in 2008 International Interconnect Technology Conference (01.06.2008)
Get full text
Conference Proceeding