Potential pharmacological mechanisms of four active compounds of Macleaya cordata extract against enteritis based on network pharmacology and molecular docking technology
Yang, Pingrui, Zhong, Chonghua, Huang, Huan, Li, Xifeng, Du, Lin, Zhang, Lifang, Bi, Shicheng, Du, Hongxu, Ma, Qi, Cao, Liting
Published in Frontiers in physiology (02.05.2023)
Published in Frontiers in physiology (02.05.2023)
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Journal Article
Development of a Simple Single-Acupoint Electroacupuncture Frame and Evaluation of the Acupuncture Effect in Rabbits
Huang, Huan, Zhang, Jianrong, Gui, Fuxing, Liu, Sheng, Zhong, Chonghua, Wang, Tingting, Du, Hongxu, He, Xianlin, Cao, Liting
Published in Veterinary sciences (05.10.2021)
Published in Veterinary sciences (05.10.2021)
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Journal Article
Optimizing the purification process of polyphenols of sea buckthorn seed and its potential freshness effect
Huang, Huan, Li, Yantao, Gui, Fuxing, Yang, Pingrui, Zhang, Jianrong, Li, Weihao, Zhong, Chonghua, Cao, Liting
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Published in Food science & technology (01.01.2023)
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Journal Article
Characterization of fine-pitch solder bump joint and package warpage for low K high-pin-count flip-chip BGA through Shadow Moiré and Micro Moiré techniques
An-Hong Liu, Wang, David W., Hsiang-Ming Huang, Ming Sun, Muh-Ren Lin, Chonghua Zhong, Sheng-Jye Hwang, Hsuan-Heng Lu
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
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Conference Proceeding
Correlation between Shadow Moiré and Micro Moiré techniques through characterization of flip-chip BGA
An-Hong Liu, Wang, D. W., Hsiang-Ming Huang, Ming Sun, Muh-Ren Lin, Chonghua Zhong, Sheng-Jye Hwang, Hsuan-Heng Lu, Huy-Tien Bui, Shang-Shiuan Deng
Published in 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2011)
Published in 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2011)
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Conference Proceeding
시스템 인 패키지 팬 아웃 적층 아키텍처 및 프로세스 흐름
YANG SE YOUNG, ZHAI JUN, HU KUNZHONG, ZHONG CHONGHUA, PANG MENGZHI, LAI KWAN YU
Year of Publication 20.09.2017
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Year of Publication 20.09.2017
Patent
3D Package with Chip-on-Reconstituted Wafer or Reconstituted Wafer-on-Reconstituted Wafer Bonding
Lu, Jiongxin, Zhai, Jun, Dabral, Sanjay, Zhong, Chonghua, Hu, Kunzhong
Year of Publication 28.03.2024
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Year of Publication 28.03.2024
Patent
3D Package with Chip-on-Reconstituted Wafer or Reconstituted Wafer-on-Reconstituted Wafer Bonding
Lu, Jiongxin, Zhai, Jun, Dabral, Sanjay, Zhong, Chonghua, Hu, Kunzhong
Year of Publication 28.03.2024
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Year of Publication 28.03.2024
Patent