by Hu, Xiaowu, Li, Yulong, Liu, Yi, Min, Zhixian
Published in Journal of alloys and compounds (15.03.2015)

by Hu, Xiaowu, Li, Yulong, Min, Zhixian
Published in Journal of alloys and compounds (05.01.2014)

by Hu, Xiaowu, Li, Yulong, Liu, Yong, Liu, Yi, Min, Zhixian
Published in Microelectronics and reliability (01.08.2014)

by Hu, Xiaowu, Li, Ke, Min, Zhixian
Published in Journal of alloys and compounds (01.07.2013)

by He, Wei, Yin, Baiqiang, Yuan, Zhijie, Wu, Wei, Min, Zhixian
Published in AIP advances (01.11.2023)

by Hu, Xiaowu, Li, Yulong, Min, Zhixian
Published in Journal of materials science. Materials in electronics (01.06.2013)

by Hu, Xiaowu, Chen, Wenjing, Yu, Xiao, Li, Yulong, Liu, Yi, Min, Zhixian
Published in Journal of alloys and compounds (05.07.2014)

by Wan, Yongqiang, Liu, Xiaoli, Hu, Xiaowu, Min, Zhixian, Yi, Guangbin, Jiang, Xiongxin, Li, Yulong
Published in Journal of materials science. Materials in electronics (01.11.2018)

by Hu, Xiaowu, Huang, Qiang, Li, Yulong, Liu, Yi, Min, Zhixian
Published in Journal of materials science. Materials in electronics (01.07.2015)

by Hu, Xiaowu, Yu, Xiao, Li, Yulong, Huang, Qiang, Liu, Yi, Min, Zhixian
Published in Journal of materials science. Materials in electronics (01.01.2014)

by Hu, Xiaowu, Li, Yulong, Li, Ke, Min, Zhixian
Published in Journal of electronic materials (01.12.2013)

by Luo, Wenzhong, Shen, Jun, Min, Zhixian, Fu, Hengzhi
Published in Journal of crystal growth (01.12.2008)

by Min, Zhixian, Shen, Jun, Feng, Zhourong, Wang, Lingshui, Wang, Lei, Fu, Hengzhi
Published in Journal of crystal growth (01.04.2011)

by He, Wei, Yuan, Zhijie, Yin, Baiqiang, Wu, Wei, Min, Zhixian
Published in Measurement science & technology (01.10.2023)

by Hu, Xiaowu, Bao, Nifa, Min, Zhixian
Published in Journal of materials science. Materials in electronics (01.01.2019)

by Min, Zhixian, Qiu, Yu, Hu, Xiaowu, Wang, Haozhong
Published in Journal of materials science. Materials in electronics (01.08.2019)

by Qiu, Yu, Zhu, Guozhen, Min, Zhixian, Liu, Yong
Published in Engineering failure analysis (01.05.2021)

by Hu, Xiaowu, Xu, Tao, Jiang, Xiongxin, Li, Yulong, Liu, Yi, Min, Zhixian
Published in Applied physics. A, Materials science & processing (01.04.2016)

by Zhixian Min, Yingxia Qiu
Published in 2015 16th International Conference on Electronic Packaging Technology (ICEPT) (01.08.2015)

by Hu, Xiaowu, Li, Ke, Min, Zhixian
Published in Journal of alloys and compounds (25.07.2013)