Experimental and simulation investigation on thermal-vibratory stress relief process for 7075 aluminium alloy
Gao, Hanjun, Wu, Shaofeng, Wu, Qiong, Li, Bianhong, Gao, Zihan, Zhang, Yidu, Mo, Shuai
Published in Materials & design (01.10.2020)
Published in Materials & design (01.10.2020)
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Journal Article
Residual stress relief mechanisms of 2219 Al–Cu alloy by thermal stress relief method
Song, Hechuan, Gao, Hanjun, Wu, Qiong, Zhang, Yidu
Published in Reviews on advanced materials science (02.03.2022)
Published in Reviews on advanced materials science (02.03.2022)
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Deflection of film under biaxial tension and central concentrated load
Zhang, Yidu, Shui, Langquan, Liu, Yongshou
Published in Archive of applied mechanics (1991) (01.09.2022)
Published in Archive of applied mechanics (1991) (01.09.2022)
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Joint Acquisition Time Design and Sensor Association for Wireless Sensor Networks in Microgrids
Zhong, Liang, Zhang, Shizhong, Zhang, Yidu, Chen, Guang, Liu, Yong
Published in Energies (Basel) (01.11.2021)
Published in Energies (Basel) (01.11.2021)
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Effects of Machine Tool Configuration on Its Dynamics Based on Orthogonal Experiment Method
GAO, Xiangsheng, ZHANG, Yidu, ZHANG, Hongwei, WU, Qiong
Published in Chinese journal of aeronautics (01.04.2012)
Published in Chinese journal of aeronautics (01.04.2012)
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Journal Article
Load Sharing Behavior of Star Gearing Reducer for Geared Turbofan Engine
MO, Shuai, ZHANG, Yidu, WU, Qiong, WANG, Feiming, MATSUMURA, Shigeki, HOUJOH, Haruo
Published in Chinese journal of mechanical engineering (01.07.2017)
Published in Chinese journal of mechanical engineering (01.07.2017)
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Journal Article
Dynamic characteristics analysis and vibration experiment of Upper-time of Flight Counter (U-ToFC)
Wu, Qiong, Zhang, Yidu, Song, Sunguang
Published in Chinese journal of mechanical engineering (01.09.2012)
Published in Chinese journal of mechanical engineering (01.09.2012)
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Journal Article
A Flow Classification Algorithm based on FPGA and CPU Collaboration
Dasheng, Zhao, Yidu, Zhang, Xin, Huang, Yaowen, Ye
Published in 2022 IEEE 20th International Conference on Embedded and Ubiquitous Computing (EUC) (01.12.2022)
Published in 2022 IEEE 20th International Conference on Embedded and Ubiquitous Computing (EUC) (01.12.2022)
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