Study of High Speed Current Excitation Reverse Engineering Methodology Using Measured Voltage and PDN Impedance Profile from a Running Microprocessor
Since, H.J.H., Jalaluddin, B.Y.A., Yeong, O.A.Y.
Published in 2007 IEEE Electrical Performance of Electronic Packaging (01.10.2007)
Published in 2007 IEEE Electrical Performance of Electronic Packaging (01.10.2007)
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