The study of compressive and tensile stress on MOSFET's I-V, C-V characteristics and it's impacts on hot carrier injection and negative bias temperature instability
Shih, J.R., Wang, J.J., Ken, W., Yeng Peng, Yue, J.T.
Published in 2003 IEEE International Reliability Physics Symposium Proceedings, 2003. 41st Annual (2003)
Published in 2003 IEEE International Reliability Physics Symposium Proceedings, 2003. 41st Annual (2003)
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Conference Proceeding
Real case study for isothermal EM test as a process control methodology
Shun-Yi Lee, Lai, J.B., Lee, S.C., Chu, L.H., Huang, Y.S., Shiue, R.Y., Peng, Y.K., Yue, J.T.
Published in 2001 IEEE International Reliability Physics Symposium Proceedings. 39th Annual (Cat. No.00CH37167) (2001)
Published in 2001 IEEE International Reliability Physics Symposium Proceedings. 39th Annual (Cat. No.00CH37167) (2001)
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Conference Proceeding
Novel ESD protection structure with embedded SCR LDMOS for smart power technology
Jian-Hsing Lee, Shih, J.R., Tang, C.S., Liu, K.C., Wu, Y.H., Shiue, R.Y., Ong, T.C., Peng, Y.K., Yue, J.T.
Published in 2002 IEEE International Reliability Physics Symposium. Proceedings. 40th Annual (Cat. No.02CH37320) (2002)
Published in 2002 IEEE International Reliability Physics Symposium. Proceedings. 40th Annual (Cat. No.02CH37320) (2002)
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Conference Proceeding
Hot-carrier-reliability design rules for translating device degradation to CMOS digital circuit degradation
Quader, K.N., Peng Fang, Yue, J.T., Ko, P.K., Chenming Hu
Published in IEEE transactions on electron devices (01.05.1994)
Published in IEEE transactions on electron devices (01.05.1994)
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Journal Article
N-FET HCI reliability improvement by nitrogen interstitialization and its mechanism
Shih, J.R., Chiang, M.C., Lin, H.C., Shiue, R.Y., Yeng Peng, Yue, J.T.
Published in 2002 IEEE International Reliability Physics Symposium. Proceedings. 40th Annual (Cat. No.02CH37320) (2002)
Published in 2002 IEEE International Reliability Physics Symposium. Proceedings. 40th Annual (Cat. No.02CH37320) (2002)
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Conference Proceeding
The Isothermal Wafer Level Test for VLSl Interconnect Evaluation
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Conference Proceeding
Analysis of new hot carrier degradation phenomena: 'W' or 'S' shape evolution of LDD NMOSFET
Shih, J.R., Chu, J.H., Lee, J.H., Shiue, R.Y., Peng, Y.K., Yue, J.T.
Published in 2001 IEEE International Reliability Physics Symposium Proceedings. 39th Annual (Cat. No.00CH37167) (2001)
Published in 2001 IEEE International Reliability Physics Symposium Proceedings. 39th Annual (Cat. No.00CH37167) (2001)
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Conference Proceeding
Electromigration performance of laser planarized aluminum alloy films
Ramaswami, S., Pham, V., Yue, J.T.
Published in Seventh International IEEE Conference on VLSI Multilevel Interconnection (1990)
Published in Seventh International IEEE Conference on VLSI Multilevel Interconnection (1990)
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Conference Proceeding
The effect of CF/sub 4/ plasma on the device parameters and reliability properties of 0.18 /spl mu/m MOSFETs
Wang, R.C.J., Shih, J.R., Chu, L.H., Doong, K.Y.Y., Wang, L.S., Weil, P.C., Su, D.S., Yang, C.T., Chiu, C.C., Su, D., Peng, Y.K., Yue, J.T., Lee, J.Y.M.
Published in Proceedings of the 9th International Symposium on the Physical and Failure Analysis of Integrated Circuits (Cat. No.02TH8614) (2002)
Published in Proceedings of the 9th International Symposium on the Physical and Failure Analysis of Integrated Circuits (Cat. No.02TH8614) (2002)
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Conference Proceeding
Simulations of CMOS circuit degradation due to hot-carrier effects
Quader, K.N., Ko, P.K., Hu, C., Fang, P., Yue, J.T.
Published in 30th Annual Proceedings Reliability Physics 1992 (1992)
Published in 30th Annual Proceedings Reliability Physics 1992 (1992)
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Conference Proceeding
A via failure mode in electromigration of multilevel interconnect
Bui, N.D., Pham, V.H., Yue, J.T., Wollesen, D.L.
Published in Seventh International IEEE Conference on VLSI Multilevel Interconnection (1990)
Published in Seventh International IEEE Conference on VLSI Multilevel Interconnection (1990)
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Conference Proceeding
Stress Induced Voids in Aluminum Interconnects During IC Processing
Yue, J.T., Funsten, W.P., Taylor, R.V.
Published in 23rd International Reliability Physics Symposium (01.03.1985)
Published in 23rd International Reliability Physics Symposium (01.03.1985)
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Conference Proceeding
Impact of Ceramic Packaging Anneal on the Reliability of Al Interconnects
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Conference Proceeding