Anisotropic equivalent thermal conductivity model for efficient and accurate full-chip-scale numerical simulation of 3D stacked IC
Pi, Yudan, Wang, Ningyu, Chen, Jing, Miao, Min, Jin, Yufeng, Wang, Wei
Published in International journal of heat and mass transfer (01.05.2018)
Published in International journal of heat and mass transfer (01.05.2018)
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Journal Article
An accurate calculation method on thermal effectiveness of TSV and wire
Yudan Pi, Wei Wang, Yufeng Jin
Published in 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) (01.11.2016)
Published in 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) (01.11.2016)
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Conference Proceeding
A full chip scale numerical simulation method for thermal management of 3D IC
Ningyu Wang, Yufeng Jin, Yudan Pi, Wei Wang
Published in 2016 17th International Conference on Electronic Packaging Technology (ICEPT) (01.08.2016)
Published in 2016 17th International Conference on Electronic Packaging Technology (ICEPT) (01.08.2016)
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Conference Proceeding
Microfluidic Cooling for Distributed Hot-Spots
Yudan Pi, Wei Wang, Jing Chen, Yufeng Jin
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
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Conference Proceeding
A Fast and Low Computation Consumption Model for System-Level Thermal Management in 3D IC
Yudan Pi, Wenhua Xu, Yufeng Jin, Wei Wang, Jiaxi Zhang, Guojie Luo, Ningyu Wang, Min Miao
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
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Conference Proceeding
Groove structure for stress releasing around TSV
Han Sun, Yudan Pi, Wei Wang, Jing Chen, Yufeng Jin
Published in 2013 14th International Conference on Electronic Packaging Technology (01.08.2013)
Published in 2013 14th International Conference on Electronic Packaging Technology (01.08.2013)
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Conference Proceeding
Preliminary validation of entransy-based thermal management for 3D IC
Yudan Pi, Han Sun, Jie Huang, Wei Wang, Jing Chen, Yufeng Jin, Bingyang Cao
Published in 2013 14th International Conference on Electronic Packaging Technology (01.08.2013)
Published in 2013 14th International Conference on Electronic Packaging Technology (01.08.2013)
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Conference Proceeding
Investigations of silicon wafer bonding using thin Al and Sn films for heterogeneous integration
Zhiyuan Zhu, Shaonan Wang, Yichao Xu, Guanjiang Wang, Yudan Pi, Peiquan Wang, Yunhui Zhu, Xin Sun, Min Yu, Jing Chen, Min Miao, Yufeng Jin
Published in The 8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems (01.04.2013)
Published in The 8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems (01.04.2013)
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Conference Proceeding
A Low Computational Cost and Accurate Thermal Calculation Method for Multi-hotspot IC
Wang, Daixing, Pi, Yudan, Wang, Wei, Jin, Yufeng
Published in 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) (01.12.2018)
Published in 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) (01.12.2018)
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Conference Proceeding
High Aspect Ratio TGV Fabrication Using Photosensitive Glass Substrate
Zhao, Xudong, Pi, Yudan, Wang, Wei, Ma, Shenglin, Jin, Yufeng
Published in 2018 14th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT) (01.10.2018)
Published in 2018 14th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT) (01.10.2018)
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Conference Proceeding
Glass-on-Silicon Interposer with High Heat Dissipation Capacity and Excellent RF Compatibility
Zhu, Longguang, Pi, Yudan, Wang, Wei, Jin, Yufeng
Published in 2018 14th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT) (01.10.2018)
Published in 2018 14th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT) (01.10.2018)
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Conference Proceeding
A new method to manufacture parylene microcapillaries
Chou, Tzu-Chieh, Pi, Yudan, Xu, Han, Tai, Yu-Chong
Published in 2018 IEEE Micro Electro Mechanical Systems (MEMS) (01.01.2018)
Published in 2018 IEEE Micro Electro Mechanical Systems (MEMS) (01.01.2018)
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Conference Proceeding
CIRCUIT BOARD ASSEMBLY, ELECTRONIC APPARATUS AND BRACKET
PI, Yudan, WANG, Guangping, LU, Jianbiao, GONG, Chuncheng, ZHENG, Jiantao
Year of Publication 27.04.2023
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Year of Publication 27.04.2023
Patent