Molecular and Genetics-Based Systems for Tracing the Evolution and Exploring the Mechanisms of Human Norovirus Infections
Lin, Sheng-Chieh, Bai, Geng-Hao, Lin, Pei-Chun, Chen, Chung-Yung, Hsu, Yi-Hsiang, Lee, Yuan-Chang, Chen, Shih-Yen
Published in International journal of molecular sciences (22.05.2023)
Published in International journal of molecular sciences (22.05.2023)
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Journal Article
Desorption Ionization of Biomolecules on Metals
Hsu, Nien-Yeen, Tseng, Susan Yu, Wu, Chung-Yi, Ren, Chien-Tai, Lee, Yuan-Chang, Wong, Chi-Huey, Chen, Chung-Hsuan
Published in Analytical chemistry (Washington) (01.07.2008)
Published in Analytical chemistry (Washington) (01.07.2008)
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Journal Article
Treatment of Sewage Sludge Using Anaerobic Digestion in Malaysia: Current State and Challenges
Hanum, Farida, Yuan, Lee Chang, Kamahara, Hirotsugu, Aziz, Hamidi Abdul, Atsuta, Yoichi, Yamada, Takeshi, Daimon, Hiroyuki
Published in Frontiers in energy research (05.03.2019)
Published in Frontiers in energy research (05.03.2019)
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Journal Article
Process Development and Material Characteristics of TSV-Less Interconnection Technology for FOWLP
Wen-Wei Shen, Yu-Min Lin, Hsiang-Hung Chang, Tzu-Ying Kuo, Huan-Chun Fu, Yuan-Chang Lee, Shu-Man Lee, Ang-Ying Lin, Shin-Yi Huang, Tao-Chih Chang, Lee, Alvin, Su, Jay, Huang, Baron, Dongshun Bai, Xiao Liu, Kuan-Neng Chen
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
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Conference Proceeding
Supercritical Fluid Extraction of Quinones from Compost for Microbial Community Analysis
Atsuta, Yoichi, Sago, Yuki, Yuan, Lee Chang, Juliasih, Ni Luh Gede Ratna, Daimon, Hiroyuki
Published in Journal of chemistry (01.01.2015)
Published in Journal of chemistry (01.01.2015)
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Journal Article
Reliability evaluation of glass interposer module
Ching-Kuan Lee, Jen-Chun Wang, Chau-Jie Zhan, Wen-Wei Shen, Huan-Chun Fu, Yuan-Chang Lee, Chia-Wen Fan, Chen, K. C., Hsiang-Hung Chang, Lu, Yung Jean Rachel
Published in 2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2016)
Published in 2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2016)
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Conference Proceeding
Characterization of organic multi-mode optical waveguides for electro-optical printed circuit boards (EOPCB)
Shen, Li-Cheng, Lo, Wei-Chung, Chang, Hsiang-Hung, Fu, Huan-Chun, Lee, Yuan-Chang, Chen, Yu-Chih, Chang, Shu-Ming, Chen, Wun-Yan, Chou, Ming-Chieh
Published in Circuit world (01.01.2006)
Published in Circuit world (01.01.2006)
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Journal Article
Reliability test for integrated Glass interposer
Ching-Kuan Lee, Jen-Chun Wang, Yu-Min Lin, Chau-Jie Zhan, Wen-Wei Shen, Huan-Chun Fu, Yuan-Chang Lee, Chia-Wen Chiang, Su-Ching Chung, Su-Mei Chen, Chia-Wen Fan, Hsiang-Hung Chang, Wei-Chung Lo, Lu, Yung Jean
Published in 2016 International Conference on Electronics Packaging (ICEP) (01.04.2016)
Published in 2016 International Conference on Electronics Packaging (ICEP) (01.04.2016)
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Conference Proceeding
Low-cost TSH (through-silicon hole) interposers for 3D IC integration
Lau, John H., Ching-Kuan Lee, Chau-Jie Zhan, Sheng-Tsai Wu, Yu-Lin Chao, Ming-Ji Dai, Ra-Min Tain, Heng-Chieh Chien, Chun-Hsien Chien, Ren-Shin Cheng, Yu-Wei Huang, Yuan-Chang Lee, Zhi-Cheng Hsiao, Wen-Li Tsai, Pai-Cheng Chang, Huan-Chun Fu, Yu-Mei Cheng, Li-Ling Liao, Wei-Chung Lo, Ming-Jer Kao
Published in 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) (01.05.2014)
Published in 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) (01.05.2014)
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Conference Proceeding
Performance and process characteristic of glass interposer with through-glass-via(TGV)
Chun-Hsien Chien, Hsun Yu, Ching-Kuan Lee, Yu-Min Lin, Ren-Shin Cheng, Chau-Jie Zhan, Peng-Shu Chen, Chang-Chih Liu, Chao-Kai Hsu, Hsiang-Hung Chang, Huan-Chun Fu, Yuan-Chang Lee, Wen-Wei Shen, Cheng-Ta Ko, Wei-Chung Lo, Lu, Yung Jean
Published in 2013 IEEE International 3D Systems Integration Conference (3DIC) (01.10.2013)
Published in 2013 IEEE International 3D Systems Integration Conference (3DIC) (01.10.2013)
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Conference Proceeding
Investigation of the process for glass interposer
Ching-Kuan Lee, Chun-Hsien Chien, Chia-Wen Chiang, Wen-Wei Shen, Huan-Chun Fu, Yuan-Chang Lee, Wen-Li Tsai, Jen-Chun Wang, Pai-Cheng Chang, Chau-Jie Zhan, Yu-Min Lin, Ren-Shin Cheng, Cheng-Ta Ko, Wei-Chung Lo, Rachel, Yung-Jean Lu
Published in 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2013)
Published in 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2013)
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Conference Proceeding
A clamped through silicon via (TSV) interconnection for stacked chip bonding using metal cap on pad and metal column forming in via
Li-Cheng Shen, Chien-Wei Chien, Jin-Ye Jaung, Yin-Po Hung, Wei-Chung Lo, Chao-Kai Hsu, Yuan-Chang Lee, Hsien-Chie Cheng, Chia-Te Lin
Published in 2008 58th Electronic Components and Technology Conference (01.05.2008)
Published in 2008 58th Electronic Components and Technology Conference (01.05.2008)
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Conference Proceeding
Flexible and ultra-thin embedded chip package
Tzu-Ying Kuo, Ying-Ching Shih, Yuan-Chang Lee, Hsiang-Hung Chang, Zhi-Cheng Hsiao, Chia-Wen Chiang, Shu-Man Li, Yu-Jiau Hwang, Cheng-Ta Ko, Yu-Hua Chen
Published in 2009 59th Electronic Components and Technology Conference (01.05.2009)
Published in 2009 59th Electronic Components and Technology Conference (01.05.2009)
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Conference Proceeding
Are Preference Reversals due to Decision Contexts or Elicitation Procedures? A Theoretical Reconciliation
Lee, Chang-Yuan, Mazar, Nina, Morewedge, Carey
Published in Advances in Consumer Research (01.01.2021)
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Published in Advances in Consumer Research (01.01.2021)
Conference Proceeding
Stretchable circuit with elastic bumps
Ying-Ching Shih, Cheng-Ta Ko, Yuan-Chang Lee, Yu-Jiau Hwang, Huan-Chun Fu, Kuo-Chyuan Chen, Zhi-Cheng Hsiao, Chih-Yuan Cheng, Yu-Hua Chen
Published in 2008 2nd Electronics System-Integration Technology Conference (01.09.2008)
Published in 2008 2nd Electronics System-Integration Technology Conference (01.09.2008)
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Conference Proceeding
Chip Embedded Wafer Level Packaging Technology for Stacked RF-SiP Application
Chien-Wei Chien, Li-Cheng Shen, Tao-Chih Chang, Chin-Yao Chang, Fang-Jun Leu, Tsung-Fu Yang, Cheng-Ta Ko, Ching-Kuan Lee, Chao-Kai Shu, Yuan-Chang Lee, Ying-Ching Shih
Published in 2007 Proceedings 57th Electronic Components and Technology Conference (01.05.2007)
Published in 2007 Proceedings 57th Electronic Components and Technology Conference (01.05.2007)
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Conference Proceeding