The loading effect study in Metal Hard-Mask All-In-One etch with double patterning scheme
Kefang Yuan, Junqing Zhou, Zhidong Wang, Minda Hu, Qiyang He, Haiyang Zhang
Published in 2017 China Semiconductor Technology International Conference (CSTIC) (01.03.2017)
Published in 2017 China Semiconductor Technology International Conference (CSTIC) (01.03.2017)
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Conference Proceeding
The Cu exposure effect in AIO etch at advanced CMOS technologies
Zhou, Junqing, He, Qiyang, Hu, Minda, Yuan, Kefang, Cao, Yibin, Sun, Linlin, Song, Xinghua, Zhang, Haiyang
Published in 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC) (01.05.2016)
Published in 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC) (01.05.2016)
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Conference Proceeding
Journal Article
Via Bottom Profile Optimization in All-in-One Etch with Double Patterning Scheme
Yuan, Ke-Fang, Zhou, Jun-Qing, Hu, Min-Da, He, Qi-Yang, Zhang, Hai-Yang
Published in ECS transactions (01.08.2017)
Published in ECS transactions (01.08.2017)
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Journal Article
Electroplating Device
Huang, Zhongxi, Zhang, Daiqiong (Diana), Zhu, Xunwei (Will), Nie, Jianhua, Zhou, Chunyan (Cherie), Peng, Dongqing (Gates), Yuan, Kefang, Deng, Zhongpu (Johnson)
Year of Publication 18.07.2024
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Year of Publication 18.07.2024
Patent
Galvanisierungsvorrichtung
Zhu, Xunwei, Peng, Dongqing, Huang, Zhongxi, Nie, Jianhua, Zhang, Daiqiong, Deng, Zhongpu, Zhou, Chunyan, Yuan, Kefang
Year of Publication 18.07.2024
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Year of Publication 18.07.2024
Patent