Hygroscopic Swelling Effect on Polymeric Materials and Thermo-hygro-mechanical Design on Finger Printer Package
Hsiang-Chen Hsu, Yu-Teng Hsu, Wen-Lo Hsich, Meng-Chieh Weng, Shao-Tang ZhangJian, Feng-Jui Hsu, Yi-Feng Chen, Shen-Li Fu
Published in 2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference (01.10.2008)
Published in 2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference (01.10.2008)
Get full text
Conference Proceeding
Parametric Study and Optimal Design in Wire Bonding Process for Mini Stack-Die Package
Hsiang-Chen Hsu, Shen-Wen Yu, Yu-Teng Hsu, Wei-Yaw Chang, Ming-Jer Lin, Ruei-Ming Lin, Pei-Chieh Chin, Hung-Chun Ho, Ming-Cheng Lu, Cheng-Tung Lee, Chin-Liang Chen, Chien-Hung Liao, Yu-Jung Huang, Shen-Li Fu, Li-Shan Chen
Published in 2006 7th International Conference on Electronic Packaging Technology (01.08.2006)
Published in 2006 7th International Conference on Electronic Packaging Technology (01.08.2006)
Get full text
Conference Proceeding
Personalized Audio Quality Preference Prediction
Chung-Che, Wang, Yu-Chun, Lin, Yu-Teng, Hsu, Jang, Jyh-Shing Roger
Published in arXiv.org (16.02.2023)
Get full text
Published in arXiv.org (16.02.2023)
Paper