A W-Band Medium Power Amplifier in 90 nm CMOS
Jiang, Yu-Sian, Tsai, Jeng-Han, Wang, Huei
Published in IEEE microwave and wireless components letters (01.12.2008)
Published in IEEE microwave and wireless components letters (01.12.2008)
Get full text
Journal Article
Analysis and Design of Bandpass Single-Pole-Double-Throw FET Filter-Integrated Switches
Zuo-Min Tsai, Yu-Sian Jiang, Lee, J., Kun-You Lin, Huei Wang
Published in IEEE transactions on microwave theory and techniques (01.08.2007)
Published in IEEE transactions on microwave theory and techniques (01.08.2007)
Get full text
Journal Article
A 86 to 108 GHz Amplifier in 90 nm CMOS
JIANG, Yu-Sian, TSAI, Zuo-Min, TSAI, Jeng-Han, CHEN, Hsien-Te, HUEI WANG
Published in IEEE microwave and wireless components letters (01.02.2008)
Published in IEEE microwave and wireless components letters (01.02.2008)
Get full text
Journal Article
Flip-Chip-Assembled W-Band CMOS Chip Modules on Ceramic Integrated Passive Device With Transition Compensation for Millimeter-Wave System-in-Package Integration
Lu, Hsin-Chia, Kuo, Che-Chung, Lin, Po-An, Tai, Chen-Fang, Chang, Yi-Long, Jiang, Yu-Sian, Tsai, Jeng-Han, Hsin, Yue-Ming, Wang, Huei
Published in IEEE transactions on microwave theory and techniques (01.03.2012)
Published in IEEE transactions on microwave theory and techniques (01.03.2012)
Get full text
Journal Article
W-band flip-chip assembled CMOS amplifier with transition compensation network for SiP integration
Che-Chung Kuo, Po-An Lin, Hsin-Chia Lu, Yu-Sian Jiang, Chia-Ming Liu, Yue-Ming Hsin, Huei Wang
Published in 2010 IEEE MTT-S International Microwave Symposium (01.05.2010)
Published in 2010 IEEE MTT-S International Microwave Symposium (01.05.2010)
Get full text
Conference Proceeding
Flip-Chip-Assembled [Formula Omitted]-Band CMOS Chip Modules on Ceramic Integrated Passive Device With Transition Compensation for Millimeter-Wave System-in-Package Integration
Lu, Hsin-Chia, Kuo, Che-Chung, Lin, Po-An, Tai, Chen-Fang, Chang, Yi-Long, Jiang, Yu-Sian, Tsai, Jeng-Han, Hsin, Yue-Ming, Wang, Huei
Published in IEEE transactions on microwave theory and techniques (01.03.2012)
Published in IEEE transactions on microwave theory and techniques (01.03.2012)
Get full text
Journal Article
Flip-Chip-Assembled W-Band CMOS Chip Modules on Ceramic Integrated Passive Device With Transition Compensation for Millimeter-Wave System-in-Package Integration: Special Issue on Millimeter-Wave Circuits and Systems
LU, Hsin-Chia, KUO, Che-Chung, LIN, Po-An, TAI, Chen-Fang, CHANG, Yi-Long, JIANG, Yu-Sian, TSAI, Jeng-Han, HSIN, Yue-Ming, HUEI WANG
Published in IEEE transactions on microwave theory and techniques (2012)
Get full text
Published in IEEE transactions on microwave theory and techniques (2012)
Journal Article