Wafer Bumping, Assembly, and Reliability of Fine-Pitch Lead-Free Micro Solder Joints for 3-D IC Integration
Ching-Kuan Lee, Tao-Chih Chang, Lau, J. H., Yu-Jiau Huang, Huan-Chun Fu, Jui-Hsiung Huang, Zhi-Cheng Hsiao, Cheng-Ta Ko, Ren-Shin Cheng, Pei-Chen Chang, Kuo-Shu Kao, Yu-Lan Lu, Lo, R., Ming-Jer Kao
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.08.2012)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.08.2012)
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Journal Article
Characterization and reliability assessment of solder microbumps and assembly for 3D IC integration
Ching-Kuan Lee, Tao-Chih Chang, Yu-Jiau Huang, Huan-Chun Fu, Jui-Hsiung Huang, Zhi-Cheng Hsiao, Lau, J. H., Cheng-Ta Ko, Ren-Shin Cheng, Pei-Chen Chang, Kuo-Shu Kao, Yu-Lan Lu, Lo, R., Kao, M. J.
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
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Conference Proceeding
Wafer bumping, assembly, and reliability assessment of μbumps with 5μm pads on 10μm pitch for 3D IC integration
Ching-Kuan Lee, Chau-Jie Zhan, Lau, J. H., Yu-Jiau Huang, Huan-Chun Fu, Jui-Hsiung Huang, Zhi-Cheng Hsiao, Shang-Wei Chen, Shin-Yi Huang, Chia-Wen Fan, Yu-Min Lin, Kuo-Shu Kao, Cheng-Ta Ko, Tai-Hung Chen, Lo, R., Kao, M. J.
Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01.05.2012)
Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01.05.2012)
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Conference Proceeding
Low temperature micro-bumping assembly technology for 3D integration
Chen, Yu-Hua, Lee, Ching-Kuan, Hsiao, Zhi-Cheng, Chang, Jing-Yao, Zhan, Chau-Jie, Huang, Yu-Jiau, Chen, Shang-Wei, Huang, Shin-Yi, Fan, Chia-Wen, Lin, Yu-Min, Kao, Kuo-Shu, Ko, Cheng-Ta, Lo, Wei-Chung
Published in 2012 4th Electronic System-Integration Technology Conference (01.09.2012)
Published in 2012 4th Electronic System-Integration Technology Conference (01.09.2012)
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Conference Proceeding