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Published in 2012 SEMI Advanced Semiconductor Manufacturing Conference (01.05.2012)
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Year of Publication 12.05.2022
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Chip package with thermal dissipation structure and method for forming the same
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Year of Publication 16.01.2018
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Diffusion region routing for narrow scribe-line devices
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Year of Publication 28.06.2011
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Back end integrated WLCSP structure without aluminum pads
Yu, Hsiu-Mei, Karta, Tjandra Winata, Yang, Daniel, Chen, Shih-Ming, Cheng, Chia-Jen
Year of Publication 04.01.2011
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Year of Publication 04.01.2011
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Methods of dicing a semiconductor structure
Ku, Chin-Yu, Yu, Hsiu-Mei, Lin, Chun-Ying, Lien, Young-Chang, Chiu, Sheng-Hsiang, Yu, Ta-Jen
Year of Publication 01.11.2011
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Year of Publication 01.11.2011
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Method of fine pitch bump stripping
Tseng, Chih-Min, Yu, Hsiu-Mei, Tseng, Wen-Hsiang, Cheng, Chia-Jen, Feng, Yu-Lung, Hsieh, Tung-Wen
Year of Publication 24.08.2010
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Year of Publication 24.08.2010
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Method for forming high reliability bump structure
Chiu, Sung-Cheng, Tsai, Hao-Yi, Yu, Hsiu-Mei, Chen, Shih-Ming, Hou, Shang-Yun
Year of Publication 29.04.2008
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Year of Publication 29.04.2008
Patent