Development of Reliable, High Performance WLCSP for BSI CMOS Image Sensor for Automotive Application
Zhou, Tianshen, Ma, Shuying, Yu, Daquan, Li, Ming, Hang, Tao
Published in Sensors (Basel, Switzerland) (22.07.2020)
Published in Sensors (Basel, Switzerland) (22.07.2020)
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Journal Article
Application of Through Glass Via (TGV) Technology for Sensors Manufacturing and Packaging
Yu, Chen, Wu, Shaocheng, Zhong, Yi, Xu, Rongbin, Yu, Tian, Zhao, Jin, Yu, Daquan
Published in Sensors (Basel, Switzerland) (28.12.2023)
Published in Sensors (Basel, Switzerland) (28.12.2023)
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Journal Article
Warpage Prediction and Optimization for Embedded Silicon Fan-Out Wafer-Level Packaging Based on an Extended Theoretical Model
Chen, Cheng, Yu, Daquan, Wang, Teng, Xiao, Zhiyi, Wan, Lixi
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.05.2019)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.05.2019)
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Journal Article
Fast frequency upconversion imaging based on quasi-phase match
Jiang, YuQi, Yu, DaQuan, Mao, TianYi, He, WeiJi, Gu, GuoHua, Chen, Qian
Published in Optical and quantum electronics (01.08.2021)
Published in Optical and quantum electronics (01.08.2021)
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Journal Article
Optical Amplification at 1.5 µm in ErIII Coordination Polymer‐Doped Waveguides Based on Intramolecular Energy Transfer
Shi, Xiaowu, Man, Yi, He, Yan, Xu, Hui, Zhang, Baoping, Yu, Daquan, Lin, Zhuliang, Lv, Ziyue, Zhao, Zhiyuan, Zhang, Linqi, Chen, Yongjian, Zhang, Dan
Published in Advanced science (01.08.2024)
Published in Advanced science (01.08.2024)
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Journal Article
Properties and electric characterizations of tetraethyl orthosilicate-based plasma enhanced chemical vapor deposition oxide film deposited at 400°C for through silicon via application
Su, Meiying, Yu, Daquan, Liu, Yijun, Wan, Lixi, Song, Chongshen, Dai, Fengwei, Xue, Kai, Jing, Xiangmeng, Guidotti, Daniel
Published in Thin solid films (01.01.2014)
Published in Thin solid films (01.01.2014)
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Journal Article
33.5 A 1.25W 46.5%-Peak-Efficiency Transformer-in-Package Isolated DC-DC Converter Using Glass-Based Fan-Out Wafer-Level Packaging Achieving 50mW/mm2 Power Density
Pan, Dongfang, Li, Guolong, Miao, Fangting, Deng, Biao, Wei, Junying, Yu, Daquan, Liu, Ming, Cheng, Lin
Published in 2021 IEEE International Solid- State Circuits Conference (ISSCC) (13.02.2021)
Published in 2021 IEEE International Solid- State Circuits Conference (ISSCC) (13.02.2021)
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Conference Proceeding
A flexible polyimide cable for implantable neural probe arrays
Cheng, Ming-Yuan, Park, Woo-Tae, Yu, Aibin, Xue, Rui-Feng, Tan, Kwan Ling, Yu, Daquan, Lee, Sang-Hyun, Gan, Chee Lip, Je, Minkyu
Published in Microsystem technologies : sensors, actuators, systems integration (01.08.2013)
Published in Microsystem technologies : sensors, actuators, systems integration (01.08.2013)
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Journal Article