Three-dimensional simulation of intermetallic compound layer growth in a binary alloy system
Kim, Hee-Soo, Lee, Hyun-Jung, Yu, Yeon-Seop, Won, Yong-Sun
Published in Acta materialia (01.02.2009)
Published in Acta materialia (01.02.2009)
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Journal Article
Electrochemical Migration Failure under Biased HAST due to Photoresist Residues
Ha, Job, Yu, Yeon-Seop, Lee, Hyoung-Rok, Cho, Kang-Young
Published in 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) (07.12.2021)
Published in 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) (07.12.2021)
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Conference Proceeding
Solder Joint Reliability of Double sided Assembled PLP Package
Ha, Job, Yu, Yeon-Seop, Cho, Kang-Young
Published in 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) (02.12.2020)
Published in 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) (02.12.2020)
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Conference Proceeding
ELECTRONIC COMPONENT EMBEDDED PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
Lee Bok-Hee, Lim Ji-Hyun, Yu Yeon-Seop, Kim Tae-Seong, Choi Seong-Ryul, Lee Dong-Uk
Year of Publication 28.07.2016
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Year of Publication 28.07.2016
Patent
Printed circuit board and manufacturing method thereof
YU, YEON SEOP, CHO, EUN IN, LEE, SEOUNG JAE, HAN, THERESA, LEE, SEON HEE
Year of Publication 06.05.2015
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Year of Publication 06.05.2015
Patent
A LIGAND FOR HYDROFORMYLATION CATALYST, A CATALYST SYSTEM CONTAINING THE LIGAND, AND HYDROFORMYLATION METHOD USING THE CATALYST SYSTEM
PARK, SEONG KI, YU, YEON SEOP, LIU YE, YOON, DU WEON, SON, CHANG KYU, LIU JINYAO, KWON, O HAK, HE DEHUA, ZHU QIMING, WANGLIU TONG EN
Year of Publication 23.11.2006
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Year of Publication 23.11.2006
Patent