Enhancing Cu Wire-Bonding Reliability by a Cu-Selective Passivation Coating
Kumaravel, Dinesh Kumar, Durai, Kevin Antony Jesu, Nair, Shyam M, Nair, Shinoj S, Yu, Hailey Huijun, Alptekin, John, Chyan, Oliver M.R., Mathew, Varughese
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
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