Extremely Large 3.5D Heterogeneous Integration for the Next-Generation Packaging Technology
Lee, Ilbok, Nam, Soohyun, Kim, Sungeun, Shin, Sangho, Kim, Younglyong, Seo, Sun-Kyoung, Yu, Hae Jung, Kim, Dae-Woo
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
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Conference Proceeding
Investigation on Package Warpage and Reliability of the large size 2.5D Molded Interposer on Substrate (MIoS) Package
Nam, Soohyun, Kang, Jinhyun, Lee, Ilbok, Kim, Younglyong, Yu, Hae Jung, Kim, Dae-Woo
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
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Conference Proceeding
Characteristics of the Electrodeposited Sn-Al Lead-free Solder
Choi, Young-Joon, Yu, Hae-Jung, Kim, Young-Ugk, Kim, Young-Seok, Shin, Seung-Han, Kim, Hyoung-Chan, Sohn, H. -J., Kang, T.
Published in Meeting abstracts (Electrochemical Society) (22.02.2006)
Published in Meeting abstracts (Electrochemical Society) (22.02.2006)
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Journal Article