Wafer-Level Hermetic Bonding Using Sn/In and Cu/Ti/Au Metallization
Da-Quan Yu, Li Ling Yan, Chengkuo Lee, Won Kyoung Choi, Thew, S., Chin Keng Foo, Lau, J.H.
Published in IEEE transactions on components and packaging technologies (01.12.2009)
Published in IEEE transactions on components and packaging technologies (01.12.2009)
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Journal Article
A Novel Low-Cost and Low-Loss DS-GWG Solution using Advanced Glass Packages at V-Band
Cai, Jing, Zhang, Miao, Yu, Da Quan, Liu, Qing Huo
Published in 2023 IEEE MTT-S International Wireless Symposium (IWS) (14.05.2023)
Published in 2023 IEEE MTT-S International Wireless Symposium (IWS) (14.05.2023)
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Conference Proceeding
The Ultimate Step to Predict Yield Impact from Mask by Litho Printability Review
Lo, Ching Shu, Yu, Da Quan, Ren, Maohua, Chang, Chin Kuei
Published in 2023 International Workshop on Advanced Patterning Solutions (IWAPS) (26.10.2023)
Published in 2023 International Workshop on Advanced Patterning Solutions (IWAPS) (26.10.2023)
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Conference Proceeding
A Novel Air-Filled Post-Wall Waveguide based on the Column Grid Array Packaging
Wu, Shuyue, Zhou, Qing, Zhang, Miao, Yu, Da Quan, Huo Liu, Qing
Published in 2023 International Conference on Microwave and Millimeter Wave Technology (ICMMT) (14.05.2023)
Published in 2023 International Conference on Microwave and Millimeter Wave Technology (ICMMT) (14.05.2023)
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Conference Proceeding
Development of Fine Pitch Solder Microbumps for 3D Chip Stacking
Aibin Yu, Kumar, A., Soon Wee Ho, Hnin Wai Yin, Lau, J.H., Khong Chee Houe, Lim Pei Siang, S., Xiaowu Zhang, Da-Quan Yu, Nandar Su, Chew Bi-Rong, M., Jong Ming Ching, Tan Teck Chun, Kripesh, V., Lee, C., Jun Pin Huang, Chiang, J., Chen, S., Chi-Hsin Chiu, Chang-Yueh Chan, Chin-Huang Chang, Chih-Ming Huang, Cheng-Hsu Hsiao
Published in 2008 10th Electronics Packaging Technology Conference (01.12.2008)
Published in 2008 10th Electronics Packaging Technology Conference (01.12.2008)
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Conference Proceeding
Fast frequency upconversion imaging based on quasi-phase match
Jiang, YuQi, Yu, DaQuan, Mao, TianYi, He, WeiJi, Gu, GuoHua, Chen, Qian
Published in Optical and quantum electronics (01.08.2021)
Published in Optical and quantum electronics (01.08.2021)
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Journal Article
Electrochemical migration study of fine pitch lead free micro bump interconnect
Yu, Da-Quan, Chai, Tai Chong, Thew, Meei Ling, Ong, Yue Ying
Published in 2009 11th Electronics Packaging Technology Conference (01.12.2009)
Published in 2009 11th Electronics Packaging Technology Conference (01.12.2009)
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Conference Proceeding
Travel Motivation of Domestic Tourists to the Changbai Mountain Biosphere Reserve in Northeastern China： A Comparative Study
Gu, Xiao-ping, Lewis, Bernard J., Li, Yan-quan, Yu, Da-pao, Zhou, Li, Zhou, Wang-ming, Wu, Sheng-nan, Dai, Li-min
Published in Journal of mountain science (01.11.2015)
Published in Journal of mountain science (01.11.2015)
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Journal Article
Electromigration study of 50 µm pitch micro solder bumps using four-point Kelvin structure
Da-Quan Yu, Tai Chong Chai, Meei Ling Thew, Yue Ying Ong, Rao, V.S., Leong Ching Wai, Lau, J.H.
Published in 2009 59th Electronic Components and Technology Conference (01.05.2009)
Published in 2009 59th Electronic Components and Technology Conference (01.05.2009)
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Conference Proceeding
Study of 15µm pitch solder microbumps for 3D IC integration
Aibin Yu, Lau, J.H., Soon Wee Ho, Kumar, A., Wai Yin Hnin, Da-Quan Yu, Ming Ching Jong, Kripesh, V., Pinjala, D., Dim-Lee Kwong
Published in 2009 59th Electronic Components and Technology Conference (01.05.2009)
Published in 2009 59th Electronic Components and Technology Conference (01.05.2009)
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Conference Proceeding