Age, creatinine and ejection fraction (ACEF) score: a simple risk-stratified method for infective endocarditis
Wei, X-B, Su, Z-D, Liu, Y-H, Wang, Y, Huang, J-L, Yu, D-Q, Chen, J-Y
Published in QJM : An International Journal of Medicine (01.12.2019)
Published in QJM : An International Journal of Medicine (01.12.2019)
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Journal Article
Properties of lead-free solder alloys with rare earth element additions
Wu, C.M.L., Yu, D.Q., Law, C.M.T., Wang, L.
Published in Materials science & engineering. R, Reports : a review journal (01.04.2004)
Published in Materials science & engineering. R, Reports : a review journal (01.04.2004)
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Journal Article
Study on the melting performance of single screw extruder with grooved melting zone and barr screw
Jin, X.-M., Jia, M.-Y., Xue, P., Cai, J.-Ch, Pan, L., Yu, D.-Q.
Published in Journal of materials processing technology (01.12.2014)
Published in Journal of materials processing technology (01.12.2014)
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Journal Article
Intermetallic compounds growth between Sn–3.5Ag lead-free solder and Cu substrate by dipping method
Yu, D.Q., Wu, C.M.L., Law, C.M.T., Wang, L., Lai, J.K.L.
Published in Journal of alloys and compounds (19.04.2005)
Published in Journal of alloys and compounds (19.04.2005)
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Journal Article
Electrochemical migration of Sn-Pb and lead free solder alloys under distilled water
YU, D. Q, JILLEK, W, SCHMITT, E
Published in Journal of materials science. Materials in electronics (01.03.2006)
Published in Journal of materials science. Materials in electronics (01.03.2006)
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Journal Article
Estimation of dietary selenium requirement for Chinese egg-laying ducks
Chen, W, Zhang, H. X, Wang, S, Ruan, D, Xie, X. Z, Yu, D. Q, Lin, Y. C
Published in Animal production science (01.01.2015)
Published in Animal production science (01.01.2015)
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Journal Article
Microstructure, solderability, and growth of intermetallic compounds of Sn-Ag-Cu-RE lead-free solder alloys
Law, C M T, Wu, C M L, Yu, D Q, Wang, L, Lai, J K L
Published in Journal of electronic materials (01.01.2006)
Published in Journal of electronic materials (01.01.2006)
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Journal Article
Tobacco transcription factor WRKY4 is a modulator of leaf development and disease resistance
Ren, X.J.,China Agricultural Univ., Beijing (China). Coll. of Agriculture and Biotechnology, Huang, W.D.,China Agricultural Univ., Beijing (China). Coll. of Agriculture and Biotechnology, Li, W.Z.,Yunnan Tobacco Science Academy, Yuxi (China). Inst. of Tobacco Agricultural Research, Yu, D.Q.,Chinese Academy of Sciences, Kunming (China). Xishuangbanna Tropical Botanical Garden
Published in Biologia plantarum (01.12.2010)
Published in Biologia plantarum (01.12.2010)
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Journal Article
The wettability and microstructure of Sn-Zn-RE alloys
WU, C. M. L, LAW, C. M. T, YU, D. Q, WANG, L
Published in Journal of electronic materials (01.02.2003)
Published in Journal of electronic materials (01.02.2003)
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Journal Article
The properties of Sn-9Zn lead-free solder alloys doped with trace rare earth elements
WU, C. M. L, YU, D. Q, LAW, C. M. T, WANG, L
Published in Journal of electronic materials (01.09.2002)
Published in Journal of electronic materials (01.09.2002)
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Journal Article
Microstructure and mechanical properties of new lead-free Sn-Cu-RE solder alloys
WU, C. M. L, YU, D. Q, LAW, C. M. T, WANG, L
Published in Journal of electronic materials (01.09.2002)
Published in Journal of electronic materials (01.09.2002)
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Journal Article
Electrochemical migration of lead free solder joints
YU, D. Q, JILLEK, W, SCHMITT, E
Published in Journal of materials science. Materials in electronics (01.03.2006)
Published in Journal of materials science. Materials in electronics (01.03.2006)
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Journal Article
The formation of nano-Ag3Sn particles on the intermetallic compounds during wetting reaction
Yu, D.Q., Wang, L., Wu, C.M.L., Law, C.M.T.
Published in Journal of alloys and compounds (08.03.2005)
Published in Journal of alloys and compounds (08.03.2005)
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Journal Article
Electromigration performance of Through Silicon Via (TSV) – A modeling approach
Tan, Y.C., Tan, C.M., Zhang, X.W., Chai, T.C., Yu, D.Q.
Published in Microelectronics and reliability (01.09.2010)
Published in Microelectronics and reliability (01.09.2010)
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Journal Article
Conference Proceeding
Viscosity and Surface Tension of Liquid Sn-Cu Lead-Free Solders
Zhao, N., Pan, X.M., Yu, D.Q., Ma, H.T., Wang, L.
Published in Journal of electronic materials (01.06.2009)
Published in Journal of electronic materials (01.06.2009)
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