Thermal-Electric Transient analysis for Metal Line under High Frequency Pulse Direct Current
Zhang, Haojun, Shen, Tian, Yap, Sing Hui, Young-Fisher, Kristina, Justison, Patrick
Published in 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.05.2019)
Published in 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.05.2019)
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Conference Proceeding
Leakage Current-Forming Voltage Relation and Oxygen Gettering in [Formula Omitted] RRAM Devices
Young-Fisher, Kristina G, Bersuker, Gennadi, Butcher, Brian, Padovani, Andrea, Larcher, Luca, Veksler, D, Gilmer, David C
Published in IEEE electron device letters (01.06.2013)
Published in IEEE electron device letters (01.06.2013)
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Journal Article
Chip Package Interaction (CPI) risk assessment of 22FDX® Wafer Level Chip Scale Package (WLCSP) using 2D Finite Element Analysis modeling
Machani, Kashi Vishwanath, Kuechenmeister, Frank, Breuer, Dirk, Klewer, Christian, Cho, Jae Kyu, Young-Fisher, Kristina
Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01.06.2020)
Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01.06.2020)
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Conference Proceeding
45RFSOI WLCSP Board Level Package Risk Assessment and Solder Joint Reliability Performance Improvement
Zhang, Haojun, Wu, Zhuo-Jie, Malinowski, John, Carino, Millete, Young-Fisher, Kristina, Trewhella, Jean, Justison, Patrick
Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01.06.2020)
Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01.06.2020)
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Conference Proceeding
Bond pads with surrounding fill lines
Pozder, Scott, Raman, Thiagarajan, Young-Fisher, Kristina, Stone, David
Year of Publication 18.02.2020
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Year of Publication 18.02.2020
Patent
BOND PADS WITH SURROUNDING FILL LINES
Pozder, Scott, Raman, Thiagarajan, Young-Fisher, Kristina, Stone, David
Year of Publication 25.07.2019
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Year of Publication 25.07.2019
Patent
BOND-PADS MIT UMGEBENDEN FÜLLLEITUNGEN UND VERFAHREN
Pozder, Scott, Raman, Thiagarajan, Young-Fisher, Kristina, Stone, David
Year of Publication 11.08.2022
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Year of Publication 11.08.2022
Patent
Bond pads with surrounding fill lines
YOUNG-FISHER, KRISTINA, STONE, DAVID, POZDER, SCOTT, RAMAN, THIAGARAJAN
Year of Publication 21.07.2020
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Year of Publication 21.07.2020
Patent
Bond pads with surrounding fill lines
YOUNG-FISHER, KRISTINA, STONE, DAVID, POZDER, SCOTT, RAMAN, THIAGARAJAN
Year of Publication 16.10.2019
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Year of Publication 16.10.2019
Patent
BOND-PADS MIT UMGEBENDEN FÜLLLEITUNGEN
Pozder, Scott, Raman, Thiagarajan, Young-Fisher, Kristina, Stone, David
Year of Publication 25.07.2019
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Year of Publication 25.07.2019
Patent