Electromigration of solder balls for wafer-level packaging with different under bump metallurgy and redistribution layer thickness
Hau-Riege, Christine, Keser, Beth, You-Wen Yau, Bezuk, Steve
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
Get full text
Conference Proceeding
A study of wafer level package board level reliability
Xu, Steven, Keser, Beth, Hau-Riege, Christine, Bezuk, Steve, You-Wen Yau
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
Get full text
Conference Proceeding
Electromigration studies of lead-free solder balls used for wafer-level packaging
Hau-Riege, Christine, Zang, Ricky, You-Wen Yau, Yadav, Praveen, Keser, Beth, Jong-Kai Lin
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
Get full text
Conference Proceeding
The impact of 45 to 28nm node-scaling on the electromigration of flip-chip bumps
Hau-Riege, C., You-Wen Yau, Zhao, L.
Published in 2012 IEEE International Reliability Physics Symposium (IRPS) (01.04.2012)
Published in 2012 IEEE International Reliability Physics Symposium (IRPS) (01.04.2012)
Get full text
Conference Proceeding
Electromigration characterization of lead-free flip-chip bumps for 45nm technology node
Hau-Riege, C, You-Wen Yau, Yu, Nick
Published in 2011 International Reliability Physics Symposium (01.04.2011)
Published in 2011 International Reliability Physics Symposium (01.04.2011)
Get full text
Conference Proceeding
BSIM4-based lateral diode model for LNA co-designed with ESD protection circuit
Ming-Ta Yang, Yang Du, Teng, Charles, Chang, Tony, Worley, Eugene, Liao, Ken, You-Wen Yau, Yeap, Geoffrey
Published in 2010 11th International Symposium on Quality Electronic Design (ISQED) (01.03.2010)
Published in 2010 11th International Symposium on Quality Electronic Design (ISQED) (01.03.2010)
Get full text
Conference Proceeding
BSIM4-based lateral diode model for RF ESD applications
Ming-Ta Yang, Yang Du, Teng, Charles, Chang, Tony, Worley, Eugene, Ken Liao, You-Wen Yau, Yeap, Geoffrey
Published in 2010 IEEE 11th Annual Wireless and Microwave Technology Conference (WAMICON) (01.04.2010)
Published in 2010 IEEE 11th Annual Wireless and Microwave Technology Conference (WAMICON) (01.04.2010)
Get full text
Conference Proceeding
An Innovative Understanding of Metal-Insulator-Metal (MIM)-Capacitor Degradation Under Constant-Current Stress
Chi-Chao Hung, Oates, A.S., Horng-Chih Lin, Yu-En Chang, P., Jia-Lian Wang, Cheng-Chung Huang, You-Wen Yau
Published in IEEE transactions on device and materials reliability (01.09.2007)
Published in IEEE transactions on device and materials reliability (01.09.2007)
Get full text
Magazine Article
Electromigration of Gold Metallization
Hau-Riege, Christine, Yau, YouWen
Published in 2021 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (15.09.2021)
Published in 2021 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (15.09.2021)
Get full text
Conference Proceeding
The electromigration behavior of copper pillars for different current directions and pillar shapes
Hau-Riege, Christine, YouWen Yau, Caffey, Kevin, Kumar, Rajneesh, YangYang Sun, Bao, Andy, Shah, Milind, Zhao, Lily, Bchir, Omar, Syed, Ahmer, Bezuk, Steve
Published in 2015 IEEE International Reliability Physics Symposium (01.04.2015)
Published in 2015 IEEE International Reliability Physics Symposium (01.04.2015)
Get full text
Conference Proceeding
Requirement of effective fabless/foundry interactions for achieving robust product reliability
Kalpat, S, Mogul, H, Hau-Riege, C, Hnatek, E R, Liu, J H, You-Wen Yau
Published in 2010 IEEE International Integrated Reliability Workshop Final Report (01.10.2010)
Published in 2010 IEEE International Integrated Reliability Workshop Final Report (01.10.2010)
Get full text
Conference Proceeding
Stacked redistribution layers on die
CAFFEY KEVIN PATRICK, HAU-RIEGE CHRISTINE SUNG-AN, ALVARADO REYNANTE TAMUNAN, GASTELUM DAMION BRYAN, BEZUK STEVE JOSEPH, YAU YOU-WEN, KESER LIZABETH ANN, MCALLISTER GENE HYDE
Year of Publication 27.10.2015
Get full text
Year of Publication 27.10.2015
Patent
STACKED REDISTRIBUTION LAYERS ON DIE
CAFFEY KEVIN PATRICK, HAU-RIEGE CHRISTINE SUNG-AN, ALVARADO REYNANTE TAMUNAN, MCALLISTER GENE H, GASTELUM DAMION BRYAN, BEZUK STEVE J, YAU YOU-WEN, KESER LIZABETH ANN
Year of Publication 12.02.2015
Get full text
Year of Publication 12.02.2015
Patent
Production and packaging control for repaired integrated circuits
Tseng, Shu-Jung, Su, Chi Chang, Chu, Chien-Wu, Yau, You-Wen, Yeou, Long Sheng
Year of Publication 21.04.2009
Get full text
Year of Publication 21.04.2009
Patent
Production and packaging control for repaired integrated circuits
YEOU LONG SHENG, TSENG SHU-JUNG, YAU YOU-WEN, CHU CHIEN-WU, SU CHI CHANG
Year of Publication 21.04.2009
Get full text
Year of Publication 21.04.2009
Patent
Stacked redistribution layers on die
CAFFEY KEVIN PATRICK, HAU-RIEGE CHRISTINE SUNG-AN, ALVARADO REYNANTE TAMUNAN, MCALLISTER GENE H, GASTELUM DAMION BRYAN, BEZUK STEVE J, YAU YOU-WEN, KESER LIZABETH ANN
Year of Publication 13.04.2016
Get full text
Year of Publication 13.04.2016
Patent