Fabrication of Silicon Carriers With TSV Electrical Interconnections and Embedded Thermal Solutions for High Power 3-D Packages
Aibin Yu, Khan, N., Archit, G., Pinjala, D., Kok Chuan Toh, Kripesh, V., Seung Wook Yoon, Lau, J.H.
Published in IEEE transactions on components and packaging technologies (01.09.2009)
Published in IEEE transactions on components and packaging technologies (01.09.2009)
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Journal Article
Board-level reliability of Pb-free solder joints of TSOP and various CSPs
Seung Wook Yoon, Seung Wook Yoon, Jun Ki Hong, Jun Ki Hong, Hwa Jung Kim, Hwa Jung Kim, Kwang Yoo Byun, Kwang Yoo Byun
Published in IEEE transactions on electronics packaging manufacturing (01.04.2005)
Published in IEEE transactions on electronics packaging manufacturing (01.04.2005)
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Journal Article
Study of Low-Temperature Thermocompression Bonding in Ag-In Solder for Packaging Applications
Made, Riko I, Gan, Chee Lip, Yan, Li Ling, Yu, Aibin, Yoon, Seung Wook, Lau, John H., Lee, Chengkuo
Published in Journal of electronic materials (01.02.2009)
Published in Journal of electronic materials (01.02.2009)
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Journal Article
Real Estate Auction Curating Server
YANG, HYEON SEOK, KIM, SANG MIN, LIM, HYEON JEONG, PARK, JIN WOO, KANG, HWA JIN, YOON, SEUNG WOOK
Year of Publication 26.06.2024
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Year of Publication 26.06.2024
Patent
A thick photoresist process for advanced wafer level packaging applications using JSR THB-151N negative tone UV photoresist
Rao, Vempati Srinivasa, Kripesh, Vaidyanathan, Yoon, Seung Wook, Tay, Andrew A O
Published in Journal of micromechanics and microengineering (01.09.2006)
Published in Journal of micromechanics and microengineering (01.09.2006)
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Journal Article
LEDSmart LED Information Board To Prevent Traffic Accidents Due To Black Ice
GWAK YE JUN, LEE SANG SIK, YOON SEUNG WOOK, CHOI JONG HYUN, BAE HYOUNG SIK, CHO YONG KWAN
Year of Publication 05.10.2023
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Year of Publication 05.10.2023
Patent