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"Yoon, Sang Kown"
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"Yoon, Sang Kown"
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METHOD FOR MANUFACTURING A PRINTED CIRCUIT BOARD
by
YOON
,
SANG KOWN
,
PARK, JEE YUN
Year of Publication
09.12.2014
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METHOD OF FABRICATING A ULTRA-THIN METAL PRINTED CIRCUIT BOARD
by
YOON
,
SANG KOWN
,
CHO, WON JIN
Year of Publication
13.10.2010
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METHOD OF MANUFACTURING LEEDLESS PRINTED CIRCUIT BORAD WITH STEP COVERAGE FREE PAD
by
YOON
,
SANG KOWN
,
LEE, HAN JIN
Year of Publication
01.07.2010
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RFID-EMBEDDED PRINTED CIRCUIT BORAD AND MANUFACTURING METHOD THEREOF
by
YOON
,
SANG KOWN
,
NOH, JUNG HYUN
Year of Publication
27.05.2010
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METHOD OF FABRICATING A SOLDER ON PAD FOR CORELESS PACKAGE SUBSTRATE TECHNOLOGY
by
YOON
,
SANG KOWN
,
CHO, WON JIN
Year of Publication
01.07.2009
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Metal-coated Polyether Ether Ketone Monopolar Plates for Polymer Electrolyte Membrane Fuel Cell
by
Kim, Minhyoung
,
Kang, Yun Sik
,
Park, Jee Yun
,
Yoon
,
Sang Kown
,
Sung, Yung-Eun
Published in
Bulletin of the Korean Chemical Society
(01.12.2015)
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METHOD OF EMBEDDING A COAXIAL LINE IN PRINTED CIRCULT BOARD
by
YOON
,
SANG KOWN
Year of Publication
25.05.2005
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METHOD OF FABRICATING PRINTED CIRCUIT BOARD WITH RESISTANCE TO THERMAL FATIGUE
by
YOON
,
SANG KOWN
,
LEE, MIN SEOK
Year of Publication
15.09.2009
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CARRIER FOR CORELESS SUBSTRATE PROCESSING AND PROCESS TECHNOLOGY THEREOF
by
YOON
,
SANG KOWN
,
CHO, WON JIN
Year of Publication
23.06.2009
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SEMI-ADDITIVE PCB MANUFACTURING METHOD WITH EMPLOYING UV SENSITIVE POLYIMIDE LAMINATION
by
YOON
,
SANG KOWN
,
CHO, WON JIN
Year of Publication
17.11.2008
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METHOD OF FABRICATING MULTI-LAYERED PRINTED CIRCUIT BOARD WITH A METAL BUMP
by
YOON
,
SANG KOWN
,
LEE, MIN SEOK
Year of Publication
01.09.2008
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METHOD OF LASER-TRIMMING FOR RESISTOR-EMBEDDED PRINTED CIRCUIT BOARD
by
YOON
,
SANG KOWN
,
LEE, HAN SUNG
Year of Publication
16.05.2008
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METHOD OF WAFER LEVEL PACKAGE
by
YOON
,
SANG KOWN
,
LEE, MIN SEOK
Year of Publication
14.02.2008
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METHOD OF FABRICATING PRINTED CIRCUIT BOARD WITH EMBEDDED INDUCTOR
by
YOON
,
SANG KOWN
,
LEE, MIN SEOK
Year of Publication
28.06.2007
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METHOD OF PREPARING A METAL BUMP FOR BUILDING A PACKAGE SUBSTRATE ON PRINTED CIRCUIT BOARD
by
YOON
,
SANG KOWN
,
LEE, HAN JIN
Year of Publication
02.11.2006
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METHOD OF FORMING A FINE CIRCUIT FOR PRINTED CIRCUIT BOARD
by
YOON
,
SANG KOWN
,
CHOI, HONG CHON
Year of Publication
13.10.2006
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FLAT COATING PROCESS WITH UTILIZING A RESIN COATED COPPER FOR PRINTED CIRCUIT BOARD
by
YOON
,
SANG KOWN
,
CHOI, HONG CHON
Year of Publication
30.11.2005
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METHOD OF PRECISE CONTROL OF RESISTANCE VALUE FOR RESISTOR-EMBEDDED PRINTED CIRCUIT BOARD
by
YOON
,
SANG KOWN
,
KIM, HEUNG KI
Year of Publication
16.05.2008
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FIXING MEANS FOR DRILLING THIN PRINTED CIRCUIT BOARD
by
YOON
,
SANG KOWN
,
KIM, HEUNG KI
Year of Publication
28.02.2008
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electricity
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casings or constructional details of electric apparatus
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electric techniques not otherwise provided for
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manufacture of assemblages of electrical components
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printed circuits
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basic electric elements
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