Complex board via structure induced uneven stress/strain impact on interconnect stability: SAC305, full and hybrid LTS comparison
Lee, Tae-Kyu, Park, Yujin, Ramakrishna, Gnyaneshwar, Nam, Jonghyun, Yoon, Daljin, Roh, Heera
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Get full text
Conference Proceeding