Real-Time Train Scheduling and Control Based on Model Predictive Control
Peng Wang, Yonghua Zhou, Jiajie Chen, Yangpeng Wang, Pin Wu
Published in 2010 Second WRI Global Congress on Intelligent Systems (01.12.2010)
Published in 2010 Second WRI Global Congress on Intelligent Systems (01.12.2010)
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Conference Proceeding
A highly active and stable Pd-TiO2/CDC-SiC catalyst for hydrogenation of 4-carboxybenzaldehyde
Zhou, Yonghua, Li, Xingyun, Pan, Xiulian, Bao, Xinhe
Published in Journal of materials chemistry (01.01.2012)
Published in Journal of materials chemistry (01.01.2012)
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Journal Article
Proteomic patterns as biomarkers for the early detection of schistosomiasis japonica in a rabbit model
Huang, Yuzheng, Yang, Guojing, Kurian, Dominic, Xu, Ming, Dai, Yang, Zhou, Yonghua, Xu, Yongliang, Wang, Jie, Zhang, Ying, Gao, Qi
Published in International journal of mass spectrometry (15.01.2011)
Published in International journal of mass spectrometry (15.01.2011)
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Journal Article
The Comparison Study of Board Level Drop and Set Level Drop Performance
Zhang, Guosong, Wu, Minyan, Shang, Yunpeng, Zhou, Yonghua, Tan, Tingzuo
Published in 2024 25th International Conference on Electronic Packaging Technology (ICEPT) (07.08.2024)
Published in 2024 25th International Conference on Electronic Packaging Technology (ICEPT) (07.08.2024)
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Conference Proceeding
Parallel Simulation of High-speed Trains Using Ray-based Cloud Computing
Xue, Hongyi, Zhou, Yonghua, Mei, Yiduo
Published in 2022 IEEE 10th International Conference on Computer Science and Network Technology (ICCSNT) (22.10.2022)
Published in 2022 IEEE 10th International Conference on Computer Science and Network Technology (ICCSNT) (22.10.2022)
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Conference Proceeding
Corrosion induced reliability degradation due to pad design variation
Meng, Zhong, Zhou, Yonghua
Published in 2019 20th International Conference on Electronic Packaging Technology(ICEPT) (01.08.2019)
Published in 2019 20th International Conference on Electronic Packaging Technology(ICEPT) (01.08.2019)
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Conference Proceeding
Three-point Bending Test Method Experimental Study for Package Strength and Crack Prediction through Finite Element Analysis
Wu, Minyan, Shang, Yunpeng, Tan, Tingzuo, Zhou, Yonghua
Published in 2023 24th International Conference on Electronic Packaging Technology (ICEPT) (08.08.2023)
Published in 2023 24th International Conference on Electronic Packaging Technology (ICEPT) (08.08.2023)
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Conference Proceeding