Low-stiffness silicon cantilevers with integrated heaters and piezoresistive sensors for high-density AFM thermomechanical data storage
Chui, B.W., Stowe, T.D., Yongho Sungtaek Ju, Goodson, K.E., Kenny, T.W., Mamin, H.J., Terris, B.D., Ried, R.P., Rugar, D.
Published in Journal of microelectromechanical systems (01.03.1998)
Published in Journal of microelectromechanical systems (01.03.1998)
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Journal Article
Copper-Based Conductive Composites with Tailored Thermal Expansion
Della Gaspera, Enrico, Tucker, Ryan, Star, Kurt, Lan, Esther H, Ju, Yongho Sungtaek, Dunn, Bruce
Published in ACS applied materials & interfaces (13.11.2013)
Published in ACS applied materials & interfaces (13.11.2013)
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Journal Article
Short-timescale thermal mapping of interconnects
Yongho Sungtaek Ju, Goodson, K.E.
Published in 1997 IEEE International Reliability Physics Symposium Proceedings. 35th Annual (1997)
Published in 1997 IEEE International Reliability Physics Symposium Proceedings. 35th Annual (1997)
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Conference Proceeding