Solder joint grain boundary structure and diffusivity via molecular dynamics simulations
Basaran, C., Sellers, M. S., Schultz, A. J., Kofke, D. A., Yongchang Lee
Published in 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (01.05.2012)
Published in 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (01.05.2012)
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Conference Proceeding
Wave attenuator by high dielectric corrugate chip for the mobile telephone hand-set
Taeho Son, Yongchang Lee, Uslenghi, P.L.E.
Published in IEEE Antennas and Propagation Society International Symposium. Transmitting Waves of Progress to the Next Millennium. 2000 Digest. Held in conjunction with: USNC/URSI National Radio Science Meeting (C (2000)
Published in IEEE Antennas and Propagation Society International Symposium. Transmitting Waves of Progress to the Next Millennium. 2000 Digest. Held in conjunction with: USNC/URSI National Radio Science Meeting (C (2000)
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Conference Proceeding