HMI GYRATORY SENSING SYSTEM TO ENHANCE WEARABLE DEVICE USER EXPERIENCE VIA HMI EXTENSION
YONG KHANG CHOONG, SONG WIL CHOON, HECK HOWARD L, PHUN SU SIN FLORENCE
Year of Publication 18.10.2023
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Year of Publication 18.10.2023
Patent
Crosstalk study of high speed on-package interconnects for multi-chip package
Bok Eng Cheah, Kong, Jackson, Khang Choong Yong, Lo, Louis, Po Yin Yaw
Published in 2014 IEEE International Symposium on Electromagnetic Compatibility (EMC) (01.08.2014)
Published in 2014 IEEE International Symposium on Electromagnetic Compatibility (EMC) (01.08.2014)
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Conference Proceeding
HMI GYRATORY SENSING SYSTEM TO ENHANCE WEARABLE DEVICE USER EXPERIENCE VIA HMI EXTENSION
YONG KHANG CHOONG, SONG WIL CHOON, HECK HOWARD L, PHUN SU SIN FLORENCE
Year of Publication 08.12.2021
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Year of Publication 08.12.2021
Patent
WEARABLE DEVICE, ELECTRONIC DEVICE, STORAGE MEDIUM, AND COMPUTER PROGRAM
YONG KHANG CHOONG, SONG WIL CHOON, HOWARD L HECK, SU SIN FLORENCE PHUN
Year of Publication 30.09.2021
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Year of Publication 30.09.2021
Patent
HMI 확장을 통해 웨어러블 디바이스 사용자 경험을 개량하기 위한 자이러토리 센싱 시스템
YONG KHANG CHOONG, SONG WIL CHOON, HECK HOWARD L, PHUN SU SIN FLORENCE
Year of Publication 21.02.2018
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Year of Publication 21.02.2018
Patent
A novel annular ring design for improved plated-thru-hole impedance matching
Kong, Jackson, Cheah, Bok Eng, Khang Choong Yong, Heck, Howard
Published in 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) (01.12.2017)
Published in 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) (01.12.2017)
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Conference Proceeding
3D Interconnects - The enabler of next generation multi-Gbps single-ended bus
Khang Choong Yong, Bok Eng Cheah, Kong, Jackson
Published in 2016 IEEE 37th International Electronics Manufacturing Technology (IEMT) & 18th Electronics Materials and Packaging (EMAP) Conference (01.09.2016)
Published in 2016 IEEE 37th International Electronics Manufacturing Technology (IEMT) & 18th Electronics Materials and Packaging (EMAP) Conference (01.09.2016)
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Conference Proceeding
A novel trench routing for next-generation high-speed serial buses beyond 10Gbps applications
Kong, Jackson, Bok Eng Cheah, Khang Choong Yong, Heck, Howard, Lo, Louis
Published in 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) (01.11.2016)
Published in 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) (01.11.2016)
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Conference Proceeding
ELECTRICAL INTERCONNECT FOR ELECTRONIC PACKAGE
YONG KHANG CHOONG, KOOI CHI OOI, BEH TEONG KEAT, HOWARD L HECK, BOK ENG CHEAH, JACKSON CHUNG PENG KONG, STEPHEN H HALL
Year of Publication 30.05.2016
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Year of Publication 30.05.2016
Patent
Signaling analysis of inter-chip I/O package routing for Multi-Chip Package
Khang Choong Yong, Wil Choon Song, Bok Eng Cheah, Ain, M. F.
Published in 2012 4th Asia Symposium on Quality Electronic Design (ASQED) (01.07.2012)
Published in 2012 4th Asia Symposium on Quality Electronic Design (ASQED) (01.07.2012)
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Conference Proceeding
Crystal Oscillator Interconnect Architecture with Noise Immunity
Chong, Raymond, Yong, Khang Choong
Published in 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) (01.12.2018)
Published in 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) (01.12.2018)
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Conference Proceeding
DEVICES AND METHODS FOR SIGNAL INTEGRITY PROTECTION TECHNIQUE
YONG, Khang Choong, CHEAH, Bok Eng, LIM, Min Suet, KONG, Jackson Chung Peng, OOI, Kooi Chi
Year of Publication 19.04.2024
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Year of Publication 19.04.2024
Patent
GYRATORY SENSING SYSTEM TO ENHANCE WEARABLE DEVICE USER EXPERIENCE VIA HMI EXTENSION
YONG, Khang Choong, PHUN, Su Sin Florence, SONG, Wil Choon, HECK, Howard L
Year of Publication 31.01.2024
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Year of Publication 31.01.2024
Patent