Predisposal of Interferon Regulatory Factor 1 Deficiency to Accumulate DNA Damage and Promote Osteoarthritis Development in Cartilage
Cho, Yongsik, Kim, Hyeonkyeong, Yook, Geunho, Yong, Sangmin, Kim, Soy, Lee, Narae, Kim, Yi‐Jun, Kim, Jin‐Hee, Kim, Tae Woo, Chang, Moon Jong, Lee, Kyoung Min, Chang, Chong Bum, Kang, Seung‐Baik, Kim, Jin‐Hong
Published in Arthritis & rheumatology (Hoboken, N.J.) (01.06.2024)
Published in Arthritis & rheumatology (Hoboken, N.J.) (01.06.2024)
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Journal Article
Tolerogenic nanoparticles induce type II collagen-specific regulatory T cells and ameliorate osteoarthritis
Sohn, Hee Su, Choi, Jeong Won, Jhun, JooYeon, Kwon, Sung Pil, Jung, Mungyo, Yong, Sangmin, Na, Hyun Sik, Kim, Jin-Hong, Cho, Mi-La, Kim, Byung-Soo
Published in Science advances (25.11.2022)
Published in Science advances (25.11.2022)
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Journal Article
IRF1 deficiency predisposes cartilage to accumulate DNA damage and promotes osteoarthritis development
Cho, Yongsik, Kim, Hyeonkyeong, Yook, Geunho, Yong, Sangmin, Kim, Soy, Lee, Narae, Kim, Yi-Jun, Kim, Jin-Hee, Kim, Tae Woo, Chang, Moon Jong, Lee, Kyoung Min, Chang, Chong Bum, Kang, Seung-Baik, Kim, Jin-Hong
Published in Arthritis & rheumatology (Hoboken, N.J.) (25.01.2024)
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Published in Arthritis & rheumatology (Hoboken, N.J.) (25.01.2024)
Journal Article
Semiconductor package having an interposer and method of manufacturing semiconductor package
Jung, Yanggyoo, Kang, Jinhyun, Yong, Sangmin, Ryu, Seungkwan, Kim, Sungeun
Year of Publication 25.06.2024
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Year of Publication 25.06.2024
Patent
SEMICONDUCTOR PACKAGE HAVING AN INTERPOSER AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE
KANG, JINHYUN, YONG, SANGMIN, KIM, SUNGEUN, RYU, SEUNGKWAN, JUNG, YANGGYOO
Year of Publication 12.10.2023
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Year of Publication 12.10.2023
Patent
Semiconductor package having an interposer and method of manufacturing semiconductor package
Jung, Yanggyoo, Kang, Jinhyun, Yong, Sangmin, Ryu, Seungkwan, Kim, Sungeun
Year of Publication 04.07.2023
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Year of Publication 04.07.2023
Patent
SEMICONDUCTOR PACKAGE HAVING AN INTERPOSER AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE
Jung, Yanggyoo, Kang, Jinhyun, Yong, Sangmin, Ryu, Seungkwan, Kim, Sungeun
Year of Publication 16.12.2021
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Year of Publication 16.12.2021
Patent