Impact of High Temperature Storage for Prolonged Duration on Cu Leadframe Material Properties for Automotive Applications
Zhu, Xintong, Rajoo, Ranjan, Yip, Kim Hong, Ang, Poh Chuan, Nistala, Ramesh Rao, Mo, Zhi Qiang
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
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Conference Proceeding
Influence of RF Power on Crystal Formation in Ionized Metal Plasma Ta and TaN Deposition
Zhu, Xintong, Roslan, Amirul Afiq Hamizan M, Xie, Jun, Ong, Kian Kok, Yip, Kim Hong, Nistala, Ramesh Rao, Mo, Zhi Qiang
Published in 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (24.07.2023)
Published in 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (24.07.2023)
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Conference Proceeding
Failure analysis on non-visible front-end defects in deep NWELL implantation related process
Boon, Ang Ghim, Chen, Changqing, Zhao, Si Ping, Neo, Soh Ping, Yip, Kim Hong, Loh, Sock Khim, Ng, Hui Peng, Teo, Angela, Ng, Peng Tiong
Published in Proceedings of the 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (01.07.2013)
Published in Proceedings of the 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (01.07.2013)
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Conference Proceeding
Advanced failure analysis of photon emission on FEOL failing of 45nm technology node
Chen Changqing, Ang Ghim Boon, Ng Hui Peng, Yip Kim Hong, Wang Qingxiao
Published in 2010 17th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (01.07.2010)
Published in 2010 17th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (01.07.2010)
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Conference Proceeding