Search Results - "Yi-Li Hsiao" :: K.UTB vyhledávací portál

Electromigration immortality of purely intermetallic micro -bump for 3D integration

by Hsiao-Yun Chen, Chih-Hang Tung, Yi-Li Hsiao, Jyun-lin Wu, Tung-Ching Yeh, Lin, Larry Liang-Chen, Chih Chen, Yu, Douglas Cheng-Hua
Published in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (01.05.2015)

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Generic rules to achieve bump electromigration immortality for 3D IC integration

by Hsiao-Yun Chen, Da-Yuan Shih, Cheng-Chang Wei, Chih-Hang Tung, Yi-Li Hsiao, Yu, Douglas Cheng-Hua, Yu-Chun Liang, Chih Chen
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)

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Optimization of solder height and shape to improve the thermo-mechanical reliability of wafer-level chip scale packages

by Su-Chun Yang, Chung-Jung Wu, Da-Yuan Shih, Chih-Hang Tung, Cheng-Chang Wei, Yi-Li Hsiao, Ying-Jui Huang, Yu, Douglas Chen-Hua
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)

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Method for forming a semiconductor component with a cooling structure

by Hsiao, Yi-Li, Sheu, Lawrence Chiang, Yu, Chen-Hua, Shao, Tung-Liang, Tung, Chih-Hang
Year of Publication 02.07.2024

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Bonding method of package components and bonding apparatus

by Hsiao, Yi-Li, Yu, Chen-Hua, Yang, Su-Chun, Shao, Tung-Liang, Tung, Chih-Hang
Year of Publication 09.04.2024

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METHOD FOR FORMING A SEMICONDUCTOR COMPONENT WITH A COOLING STRUCTURE

by Hsiao, Yi-Li, Sheu, Lawrence Chiang, Yu, Chen-Hua, Shao, Tung-Liang, Tung, Chih-Hang
Year of Publication 09.03.2023

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Semiconductor component with cooling structure

by Hsiao, Yi-Li, Sheu, Lawrence Chiang, Yu, Chen-Hua, Shao, Tung-Liang, Tung, Chih-Hang
Year of Publication 29.11.2022

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BONDING METHOD OF PACKAGE COMPONENTS AND BONDING APPARATUS

by Hsiao, Yi-Li, Yu, Chen-Hua, Yang, Su-Chun, Shao, Tung-Liang, Tung, Chih-Hang
Year of Publication 17.11.2022

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Bonding method of package components and bonding apparatus

by Hsiao, Yi-Li, Yu, Chen-Hua, Yang, Su-Chun, Shao, Tung-Liang, Tung, Chih-Hang
Year of Publication 13.09.2022

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Semiconductor device and bump formation process

by Hsiao, Yi-Li, Yu, Chen-Hua, Wei, Cheng-Chang, Tung, Chih-Hang, Jeng, Shin-Puu
Year of Publication 31.05.2022

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SEMICONDUCTOR COMPONENT WITH COOLING STRUCTURE

by Hsiao, Yi-Li, Sheu, Lawrence Chiang, Yu, Chen-Hua, Shao, Tung-Liang, Tung, Chih-Hang
Year of Publication 01.04.2021

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BONDING METHOD OF PACKAGE COMPONENTS AND BONDING APPARATUS

by Hsiao, Yi-Li, Yu, Chen-Hua, Yang, Su-Chun, Shao, Tung-Liang, Tung, Chih-Hang
Year of Publication 18.02.2021

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Bonding with Pre-Deoxide Process and Apparatus for Performing the Same

by Huang, Ying-Jui, Hsiao, Yi-Li, Yu, Chen-Hua, Hsieh, Ching-Hua, Yang, Su-Chun, Shao, Tung-Liang, Tung, Chih-Hang, Hwang, Chien Ling
Year of Publication 08.09.2022

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Bonding with pre-deoxide process and apparatus for performing the same

by Huang, Ying-Jui, Hsiao, Yi-Li, Yu, Chen-Hua, Hsieh, Ching-Hua, Yang, Su-Chun, Shao, Tung-Liang, Tung, Chih-Hang, Hwang, Chien Ling
Year of Publication 24.05.2022

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Patent