A method for AlCu interconnect electromigration performance predicting and monitoring
Zhang, Wenjie, Yi, Leeward, Chang, Pingyi, Wu, Jin
Published in Microelectronic engineering (01.03.2008)
Published in Microelectronic engineering (01.03.2008)
Get full text
Journal Article
Roughness and texture correlation of Al films
WENJIE ZHANG, YI, Leeward, JUINENG TU, PINGYI CHANG, DULI MAO, JIN WU
Published in Journal of electronic materials (01.10.2005)
Published in Journal of electronic materials (01.10.2005)
Get full text
Journal Article
A quick method for AlCu interconnect electromigration performance predicting and monitoring
Zhang, Wenjie, Yi, Leeward, Tao, Kai, Ma, Yue, Chang, Pingyi, Mao, Duli, Wu, Jin, Zou, S C
Published in Semiconductor science and technology (01.05.2006)
Published in Semiconductor science and technology (01.05.2006)
Get full text
Journal Article
The influence of substrate bias in I-PVD process on the properties of Ti and Al alloy films
WENJIE ZHANG, YI, Leeward, KAI TAO, YUE MA, PINGYI CHANG, JIN WU
Published in Journal of materials science. Materials in electronics (01.11.2006)
Published in Journal of materials science. Materials in electronics (01.11.2006)
Get full text
Journal Article
Comparison of metal-organic chemical vapour deposition TiN thin films with different process cycles
Yi, Leeward, Zhang, Wenjie, Wu, Jin, Mao, Duli
Published in Semiconductor science and technology (01.03.2006)
Published in Semiconductor science and technology (01.03.2006)
Get full text
Journal Article