Die attach materials impacts to copper wire bonding: New challenges
Lim Fui Yee, Yew, C. L. W.
Published in 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) (01.12.2012)
Published in 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) (01.12.2012)
Get full text
Conference Proceeding