Development of Arc-Fault Circuit-Interrupter requirements for Photovoltaic systems
Dini, D. A., Brazis, P. W., Kai-Hsiang Yen
Published in 2011 37th IEEE Photovoltaic Specialists Conference (01.06.2011)
Published in 2011 37th IEEE Photovoltaic Specialists Conference (01.06.2011)
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Conference Proceeding
Application of Lean Six Sigma to Develop a High Precision Relative Humidity Control
Yen, Kai Hsiang, Lin, Ming Lung, Wang, Carl
Published in Applied Mechanics and Materials (28.05.2015)
Published in Applied Mechanics and Materials (28.05.2015)
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Journal Article
Accelerated Aging Tests on PV Grounding Connections
Wang, Ethan, Yen, Kai-Hsiang, Wang, Carl, Ji, Liang, Zgonena, Timothy
Published in Energy procedia (2011)
Published in Energy procedia (2011)
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Journal Article
Commercialized CMOS Compatible Micro Anemometer
Yu-Jen Fang, Jen-Ye chen, Hsin-Li Lee, Kai-Hsiang Yen, Chih-Hung Wang
Published in 2006 5th IEEE Conference on Sensors (01.10.2006)
Published in 2006 5th IEEE Conference on Sensors (01.10.2006)
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Conference Proceeding
Accelerated aging tests on PV grounding connections
Wang, E., Kai-Hsiang Yen, Wang, C., Liang Ji, Zgonena, T.
Published in 2011 37th IEEE Photovoltaic Specialists Conference (01.06.2011)
Published in 2011 37th IEEE Photovoltaic Specialists Conference (01.06.2011)
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Conference Proceeding
CMOS compatible directional microphone
Po-Hsun Sung, Jen-Yi Chen, Kai-hsiang Yen, Chia-yu Wu
Published in 2007 International Microsystems, Packaging, Assembly and Circuits Technology (01.10.2007)
Published in 2007 International Microsystems, Packaging, Assembly and Circuits Technology (01.10.2007)
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Conference Proceeding
Ultra thin package for electric acoustic sensor chip of micro electro mechanical system
YEN, KAI-HSIANG, LEE, HSIN-LI, WANG, CHIN-HORNG, CHEN, JUNG-TAI, HO, TZONG, PAN, JASON, CHANG, PIN
Year of Publication 30.09.2015
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Year of Publication 30.09.2015
Patent
Ultra thin package for electric acoustic sensor chip of micro electro mechanical system
YEN KAI-HSIANG, LEE HSIN-LI, WANG CHIN-HORNG, PAN JASON, HO TZONG, CHANG PIN, CHEN JUNG-TAI
Year of Publication 13.08.2013
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Year of Publication 13.08.2013
Patent
Ultra thin package for electric acoustic sensor chip of micro electro mechanical system
YEN, KAI-HSIANG, LEE, HSIN-LI, WANG, CHIN-HORNG, CHEN, JUNG-TAI, HO, TZONG, PAN, JASON, CHANG, PIN
Year of Publication 24.07.2013
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Year of Publication 24.07.2013
Patent
ULTRA THIN PACKAGE OF ELECTRIC ACOUSTIC SENSOR CHIP OF MICROELECTROMECHANICAL SYSTEM
HAN RIKISAI, JANG PING, YEN KAI-HSIANG, LEE HSIN-LI, WANG CHIN-HORNG, HO TZONG, CHEN JUNG-TAI
Year of Publication 21.03.2013
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Year of Publication 21.03.2013
Patent