Flexible Hybrid Electronics on Wearable Healthcare Application
Chen, Ming-Hung, Chang, Wei-Hao, Pi, Tun-Ching, Lee, Wei-Chun, Kao, Jen-Chieh, Yeh, Yung-I
Published in 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) (11.09.2023)
Published in 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) (11.09.2023)
Get full text
Conference Proceeding
Patch-type Flex SiP Platform for Heathcare Application
Chen, Ming-Hung, Chang, Wei-Hao, Jian, Hui-Ping, Liu, Chao-Wei, Wu, Shang-Lin, Chou, Yi-Chun, Chiang, Sung-Hung, Chang, Jun-Kai, Pi, Tun-Ching, Lee, Wei-Chun, Kao, Jen-Chieh, Yeh, Yung-I
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
Get full text
Conference Proceeding
Demonstration of flexible encapsulation in assembly industry
Liu, Chao-Wei, Chen, Ming-Hung, Pi, Tun-Ching, Kao, Jen-Chieh, Yeh, Yung-I
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
Get full text
Conference Proceeding
A Study on the Surface Activation of Plasma Treatment for Hybrid Bonding Joint Interface
Hsu, Chih-Jing, Fang, Hsu-Nan, Su, Tzu-Yu, Jiang, Zhao-Ze, Chen, Yi-Hua, Chen, Chien-Ching, Hsu, Che-Ming, Tsai, Yu-Pin, Chiang, Yuan-Feng, Kao, Jen-Chieh, Yeh, Yung-I
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Get full text
Conference Proceeding
ELECTRONIC WEARABLE DEVICE
WU, Shang-Lin, PI, Tun-Ching, LIU, Chao Wei, CHEN, Ming-Hung, JIAN, Hui-Ping, YEH, Yung-I, KAO, Jen-Chieh, CHANG, Wei-Hao
Year of Publication 18.04.2024
Get full text
Year of Publication 18.04.2024
Patent