Ultrathin Cr added Ru film as a seedless Cu diffusion barrier for advanced Cu interconnects
Hsu, Kuo-Chung, Perng, Dung-Ching, Yeh, Jia-Bin, Wang, Yi-Chun
Published in Applied surface science (01.07.2012)
Published in Applied surface science (01.07.2012)
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Phosphorous doped Ru film for advanced Cu diffusion barriers
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Conference Proceeding
Amorphous RuW Film as a Diffusion Barrier for Advanced Cu Metallization
Yeh, Jia-Bin, Perng, Dung-Ching, Hsu, Kuo-Chung
Published in Journal of the Electrochemical Society (2010)
Published in Journal of the Electrochemical Society (2010)
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Journal Article
Thermal and Electrical Properties of PVD Ru(P) Film as Cu Diffusion Barrier
Perng, Dung-Ching, Hsu, Kuo-Chung, Tsai, Shuo-Wen, Yeh, Jia-Bin
Published in Microelectronic engineering (01.03.2010)
Published in Microelectronic engineering (01.03.2010)
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Journal Article
Conference Proceeding
Self-forming AlOx layer as Cu diffusion barrier on porous low-k film
PERNG, Dung-Ching, YEH, Jia-Bin, HSU, Kuo-Chung, TSAI, Shuo-Wen
Published in Thin solid films (2010)
Published in Thin solid films (2010)
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Journal Article
The Powerful Methods of Flicker Noise Improvement in 22nm Technology
Fang, Achilles, Pan, Jen Wei, Wu, Widson, Cho, Sheng, Chen, Wei Jun, Yeh, Jia Bin, Lee, Zhi Cheng, Liu, You Ren, Lee, Kai Lin, Chen, Leonard, Hsueh, Vincent, Hsieh, S. W., Lo, Ta Kang, Pai, Jakent, Chen, Daniel, Cheng, Yao Chin, Hsu, Steven, Cheng, Osbert, Hung, G. C.
Published in 2021 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA) (19.04.2021)
Published in 2021 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA) (19.04.2021)
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Conference Proceeding
Self-forming AlO x layer as Cu diffusion barrier on porous low-k film
Perng, Dung-Ching, Yeh, Jia-Bin, Hsu, Kuo-Chung, Tsai, Shuo-Wen
Published in Thin solid films (2010)
Published in Thin solid films (2010)
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Journal Article
A 3 nm Self-Forming InO x Diffusion Barrier for Advanced Cu/Porous Low-k Interconnects
Perng, Dung-Ching, Hsu, Kuo-Chung, Yeh, Jia-Bin
Published in Japanese Journal of Applied Physics (01.05.2010)
Published in Japanese Journal of Applied Physics (01.05.2010)
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