by Kong Boon Yeap, Fen Chen, Yao, Huade Walter, Tian Shen, Sing Fui Yap, Justison, Patrick
Published in IEEE transactions on electron devices (01.02.2016)

by Song, Xu, Yeap, Kong Boon, Zhu, Jing, Belnoue, Jonathan, Sebastiani, Marco, Bemporad, Edoardo, Zeng, Kaiyang, Korsunsky, Alexander M.
Published in Thin solid films (2012)

by Zhu, Jing, Yeap, Kong Boon, Zeng, Kaiyang, Lu, Li
Published in Thin solid films (03.01.2011)

by Yeap, Kong Boon, Zschech, Ehrenfried, Hangen, Ude D., Wyrobek, Thomas, Kong, Lay Wai, Karmakar, Aditya, Xu, Xiaopeng, Panchenko, Iuliana
Published in Journal of materials research (14.01.2012)

by Tian Shen, Kong Boon Yeap, Christiansen, Cathryn, Justison, Patrick
Published in 2017 IEEE International Reliability Physics Symposium (IRPS) (01.04.2017)

by Yeap, Kong-Boon, Kopycinska-Mueller, Malgorzata, Chen, Lei, Chen, Yu, Jungmann, Marco, Krause-Rehberg, Reinhard, Mahajan, Sukesh, Vlassak, Joost, Gall, Martin, Zschech, Ehrenfried
Published in Journal of materials research (14.05.2013)

by Yeap, Kong Boon, Zeng, Kaiyang, Chi, Dongzhi
Published in Acta materialia (01.03.2008)

by Kannan, Sukeshwar, Premachandran, C. S., Smith, Daniel, Ranjan, Rakesh, Cimino, Salvatore, Kong Boon Yeap, Wu, George, Linjun Cao, Prabhu, Manjunatha, Agarwal, Rahul, Yao, Walter, England, Luke, Justison, Patrick
Published in 2017 IEEE International Reliability Physics Symposium (IRPS) (01.04.2017)

by Yeap, Kong Boon, Kopycinska-Müller, Malgorzata, Hangen, Ude D., Zambaldi, Claudio, Hübner, René, Niese, Sven, Zschech, Ehrenfried
Published in Philosophical magazine (2003. Print) (01.09.2012)

by Tian Shen, Rajagopalan, Balajee, Silvestre, Mary Claire, Ramanathan, Eswar, Mahalingam, Anbu Selvam K. M., Wenyi Zhang, Kong Boon Yeap, Justison, Patrick
Published in 2016 IEEE International Reliability Physics Symposium (IRPS) (01.04.2016)

by Yeap, Kong Boon, Zeng, Kaiyang, Chi, Dongzhi
Published in Materials science & engineering. A, Structural materials : properties, microstructure and processing (25.08.2009)

by Kong Boon Yeap, Tian Shen, Zhang, Galor Wenyi, Sing Fui Yap, Holt, Brian, Gondal, Arfa, Seungman Choi, San Leong Liew, Yao, Walter, Justison, Patrick
Published in 2015 IEEE International Reliability Physics Symposium (01.04.2015)

by Kong Boon Yeap, Gall, M., Sander, C., Niese, S., Zhongquan Liao, Ritz, Y., Rosenkranz, R., Muhle, U., Gluch, J., Zschech, E., Aubel, O., Beyer, A., Hennesthal, C., Hauschildt, M., Talut, G., Poppe, J., Vogel, N., Engelmann, H., Stauffer, D., Major, R., Warren, O.
Published in 2013 IEEE International Reliability Physics Symposium (IRPS) (01.04.2013)

by Ogden, Sean P., Xu, Yueming, Yeap, Kong Boon, Shen, Tian, Lu, Toh-Ming, Plawsky, Joel L.
Published in Microelectronics and reliability (01.12.2018)

by Premachandran, C. S., England, Luke, Kannan, Sukeshwar, Ranjan, Rakesh, Kong Boon Yeap, Teo, Walter, Cimino, Salvatore, Tan Jing, Haojun Zhang, Smith, Daniel, Justison, Patrick, Parameshwaran, Biju, Iyer, Natarajan Mahadeva
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)

by Ogden, Sean P., Yeap, Kong Boon, Tian Shen, Justison, Patrick, Toh-Ming Lu, Plawsky, Joel L.
Published in IEEE electron device letters (01.01.2017)

by Choi, Seungman, Christiansen, Cathryn, Cao, Linjun, Zhang, James, Filippi, Ronald, Shen, Tian, Yeap, Kong Boon, Ogden, Sean, Zhang, Haojun, Fu, Bianzhu, Justison, Patrick
Published in 2018 IEEE International Reliability Physics Symposium (IRPS) (01.03.2018)

by Karmarkar, Aditya P., Xiaopeng Xu, Kong-Boon Yeap, Zschech, Ehrenfried
Published in IEEE transactions on device and materials reliability (01.06.2012)

by Shen, Tian, Yeap, Kong Boon, Ogden, Sean, Christiansen, Cathryn, Justison, Patrick
Published in 2018 IEEE International Reliability Physics Symposium (IRPS) (01.03.2018)

by Chen, Lei, Yeap, Kong Boon, Zeng, Kai Yang, She, Chong Min, Liu, Gui Rong
Published in Journal of materials research (14.10.2011)