Current Status of Research and Development for Three-Dimensional Chip Stack Technology
Kenji Takahashi, Kenji Takahashi, Hiroshi Terao, Hiroshi Terao, Yoshihiro Tomita, Yoshihiro Tomita, Yasuhiro Yamaji, Yasuhiro Yamaji, Masataka Hoshino, Masataka Hoshino, Tomotoshi Sato, Tomotoshi Sato, Tadahiro Morifuji, Tadahiro Morifuji, Masahiro Sunohara, Masahiro Sunohara, Manabu Bonkohara, Manabu Bonkohara
Published in Japanese Journal of Applied Physics (01.04.2001)
Published in Japanese Journal of Applied Physics (01.04.2001)
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Journal Article
Maskless Fabrication for Micropad Interconnection using Electroless NiB Deposition and Application to "Chemical" Flip-Chip Bonding
Yokoshima, Tokihiko, Yamaji, Yasuhiro, Igawa, Noboru, Kikuchi, Katsuya, Nakagawa, Hiroshi, Aoyagi, Masahiro
Published in ECS transactions (20.03.2009)
Published in ECS transactions (20.03.2009)
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Journal Article
Interconnection of Multi-Pad Electrodes by "Controlled Anisotropic Extraneous (CAEx) Deposition" of Electroless NiB Film
Yokoshima, Tokihiko, Yamaji, Yasuhiro, Igawa, Noboru, Tamura, Yuichiro, Kikuchi, Katsuya, Nakagawa, Hiroshi, Aoyagi, Masahiro
Published in ECS transactions (02.05.2008)
Published in ECS transactions (02.05.2008)
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Journal Article
Interconnection of Micropad Electrodes by Controlled “Extraneous” Deposition of Electroless NiB Film
Yokoshima, Tokihiko, Yamaji, Yasuhiro, Oosato, Hirotaka, Tamura, Yuichiro, Kikuchi, Katsuya, Nakagawa, Hiroshi, Aoyagi, Masahiro
Published in Electrochemical and solid-state letters (2007)
Published in Electrochemical and solid-state letters (2007)
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Journal Article
A method of "chemical flip-chip bonding" without loading and heating for ultra-fine chip-to-substrate interconnects
Yokoshima, T., Yamaji, Y., Kikuchi, K., Nakagawa, H., Aoyagi, M.
Published in 2009 59th Electronic Components and Technology Conference (01.05.2009)
Published in 2009 59th Electronic Components and Technology Conference (01.05.2009)
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Conference Proceeding
Developing a leading practical application for 3D IC chip stacking technology: How to progress from fundamental technology to application technology
AOYAGI, Masahiro, IMURA, Fumito, KATO, Fumiki, KIKUCHI, Katsuya, WATANABE, Naoya, SUZUKI, Motohiro, NAKAGAWA, Hiroshi, OKADA, Yoshikuni, YOKOSHIMA, Tokihiko, YAMAJI, Yasuhiro, NEMOTO, Shunsuke, BUI, Tung Thanh, MELAMED, Samson
Published in Synthesiology (2016)
Published in Synthesiology (2016)
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Journal Article
A Method of Fabricating Bump-Less Interconnects Applicable to Wafer-Scale Flip-Chip Bonding
Yamaji, Y., Yokoshima, T., Igawa, N., Kikuchi, K., Nakagawa, H., Aoyagi, M.
Published in 2008 10th Electronics Packaging Technology Conference (01.12.2008)
Published in 2008 10th Electronics Packaging Technology Conference (01.12.2008)
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Conference Proceeding
Novel Flip-Chip Bonding Technology using Chemical Process
Yamaji, Y., Yokoshima, T., Oosato, H., Igawa, N., Tamura, Y., Kikuchi, K., Nakagawa, H., Aoyagi, M.
Published in 2007 Proceedings 57th Electronic Components and Technology Conference (01.05.2007)
Published in 2007 Proceedings 57th Electronic Components and Technology Conference (01.05.2007)
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Conference Proceeding