Stress migration model for Cu interconnect reliability analysis
Walter Yao, H., Yiang, Kok-Yong, Justison, Patrick, Rayasam, Mahidhar, Aubel, Oliver, Poppe, Jens
Published in Journal of applied physics (01.10.2011)
Published in Journal of applied physics (01.10.2011)
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Journal Article
Impact of TSV process on 14nm FEOL and BEOL reliability
Kannan, Sukeshwar, Premachandran, C. S., Smith, Daniel, Ranjan, Rakesh, Cimino, Salvatore, Kong Boon Yeap, Wu, George, Linjun Cao, Prabhu, Manjunatha, Agarwal, Rahul, Yao, Walter, England, Luke, Justison, Patrick
Published in 2017 IEEE International Reliability Physics Symposium (IRPS) (01.04.2017)
Published in 2017 IEEE International Reliability Physics Symposium (IRPS) (01.04.2017)
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Conference Proceeding
An investigation of dielectric thickness scaling on BEOL TDDB
Tian Shen, Wenyi Zhang, Yeap, Kong Boon, Jing Tan, Yao, Walter, Justison, Patrick
Published in 2015 IEEE International Reliability Physics Symposium (01.04.2015)
Published in 2015 IEEE International Reliability Physics Symposium (01.04.2015)
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Conference Proceeding
Impact of electrode surface modulation on time-dependent dielectric breakdown
Kong Boon Yeap, Tian Shen, Zhang, Galor Wenyi, Sing Fui Yap, Holt, Brian, Gondal, Arfa, Seungman Choi, San Leong Liew, Yao, Walter, Justison, Patrick
Published in 2015 IEEE International Reliability Physics Symposium (01.04.2015)
Published in 2015 IEEE International Reliability Physics Symposium (01.04.2015)
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Conference Proceeding
Comprehensive 3D TSV Reliability Study on 14nm FINFET Technology with Thinned Wafers
Premachandran, C.S., Ranjan, Rakesh, England, Luke, Justison, Patrick, Cimino, Salvatore, Ogdan, Sean, Wu, Zhuo-Jie, Smith, Daniel, Kannan, Sukesh, Cao, Linjun, Prabhu, Manjunatha, Yao, Walter
Published in 2018 IEEE 2nd Electron Devices Technology and Manufacturing Conference (EDTM) (01.03.2018)
Published in 2018 IEEE 2nd Electron Devices Technology and Manufacturing Conference (EDTM) (01.03.2018)
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Conference Proceeding
Stress-induced-voiding risk factor and stress migration model for Cu interconnect reliability
Yao, H. W., Justison, P., Poppe, J.
Published in 2013 IEEE International Reliability Physics Symposium (IRPS) (01.04.2013)
Published in 2013 IEEE International Reliability Physics Symposium (IRPS) (01.04.2013)
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Conference Proceeding
New perspectives of dielectric breakdown in low-k interconnects
Kok-Yong Yiang, Yao, H.W., Marathe, A., Aubel, O.
Published in 2009 IEEE International Reliability Physics Symposium (01.04.2009)
Published in 2009 IEEE International Reliability Physics Symposium (01.04.2009)
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Conference Proceeding
A Study on Effect of Top and Bottom Metal Plates on Stress Induced Voiding of Nose Type Single Via Structure
Kuppar, Aniketha Udupa, Zeng, Xu, Ng, Chai Wah, Lim, YH James, Yao, H. Walter, Khor, EE jan, Chockalingam, Ramasamy, Tan, Juan Boon
Published in 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (01.07.2018)
Published in 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (01.07.2018)
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Conference Proceeding
TDDB Kinetics and their Relationship with the E- and √E-models
Yiang, Kok-Yong, Yao, H. Walter, Marathe, Amit
Published in 2008 International Interconnect Technology Conference (01.06.2008)
Published in 2008 International Interconnect Technology Conference (01.06.2008)
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Conference Proceeding