Interface mechanical behavior of gold alloy wire bonding
Xie, Shuang, Lin, Pengrong, Yao, Quanbin
Published in Journal of physics. Conference series (01.05.2021)
Published in Journal of physics. Conference series (01.05.2021)
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Journal Article
Simulation analysis of a specification package for high density and high voltage power module
Cai, Jiawei, Zhang, Long, Huang, Yingzhuo, Lin, Pengrong, Yao, Quanbin
Published in Journal of physics. Conference series (01.12.2022)
Published in Journal of physics. Conference series (01.12.2022)
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Journal Article
Transient liquid phase bonding of Sn-Pb solder with added Cu particles
Wang, Jiaxing, Lin, Pengrong, Yao, Quanbin, Huang, Yinzhuo, Xie, Xiaochen, Li, Zongyang, Zhang, Long
Published in Journal of physics. Conference series (01.01.2024)
Published in Journal of physics. Conference series (01.01.2024)
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Journal Article
Submodelling method for modelling and simulation of high-density electronic assemblies
Kong, Lingsong, Yao, Quanbin, Lv, Xiaorui, Zhao, Wenzhong
Published in Journal of physics. Conference series (01.09.2020)
Published in Journal of physics. Conference series (01.09.2020)
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Journal Article
Study on no IMC Solid state bonding method for high-density 2.5D/3D integration
Li, Zongyang, Qu, Zhibo, Yao, Quanbin, Lin, Pengrong, Xie, Xiaochen, Guo, Hengtong, Wang, Jiaxing, Hou, Pengyan, Gu, Songzhao
Published in Journal of physics. Conference series (01.09.2024)
Published in Journal of physics. Conference series (01.09.2024)
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Journal Article
The Mechanical Analysis of Sn-Base Bump
Yang, Jun, Yao, Quanbin, Lin, Pengrong, Lian, Binhao, Wang, Shengjie
Published in IOP conference series. Materials Science and Engineering (01.10.2019)
Published in IOP conference series. Materials Science and Engineering (01.10.2019)
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Journal Article
Effect of Cu on interfacial reaction in high-lead solder bumps
Liwei Xu, Mingliang Huang, Quanbin Yao, Yong Wang, Binhao Lian
Published in 2015 16th International Conference on Electronic Packaging Technology (ICEPT) (01.08.2015)
Published in 2015 16th International Conference on Electronic Packaging Technology (ICEPT) (01.08.2015)
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Conference Proceeding
The reliability of high-lead solder joints in flip-chip devices
Lingjuan Tian, Yuanfu Zhao, Quanbin Yao, Yusheng Cao, Binhao Lian
Published in 2014 15th International Conference on Electronic Packaging Technology (01.05.2014)
Published in 2014 15th International Conference on Electronic Packaging Technology (01.05.2014)
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Conference Proceeding
The influence of the solder joint void on the CCGA package reliability
Yingzhuo Huang, Binhao Lian, Quanbin Yao, Xiaorui Lv, Pengrong Lin
Published in 2014 15th International Conference on Electronic Packaging Technology (01.05.2014)
Published in 2014 15th International Conference on Electronic Packaging Technology (01.05.2014)
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Conference Proceeding
Simulation of bonding wire deformation in random vibration
Peifeng Hu, Yusheng Cao, Binhao Lian, Quanbin Yao
Published in 2013 14th International Conference on Electronic Packaging Technology (01.08.2013)
Published in 2013 14th International Conference on Electronic Packaging Technology (01.08.2013)
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Conference Proceeding
Study of the junction to case thermal resistance test method for IC based on ETM
Zhang Hongshuo, Zhao Yuanfu, Yao Quanbin, Cao Yusheng
Published in 2013 14th International Conference on Electronic Packaging Technology (01.08.2013)
Published in 2013 14th International Conference on Electronic Packaging Technology (01.08.2013)
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Conference Proceeding
The effects of Au film thickness on the reliability of Sn-Pb solder joints
Xiaorui Lv, Pengrong Lin, Yingzhuo Huang, Xueming Jiang, Binhao Lian, Quanbin Yao
Published in 2015 16th International Conference on Electronic Packaging Technology (ICEPT) (01.08.2015)
Published in 2015 16th International Conference on Electronic Packaging Technology (ICEPT) (01.08.2015)
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Conference Proceeding
Flip chip CBGA package design and simulation
Xie Wenjun, Cao Yusheng, Yao Quanbin
Published in 2013 14th International Conference on Electronic Packaging Technology (01.08.2013)
Published in 2013 14th International Conference on Electronic Packaging Technology (01.08.2013)
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Conference Proceeding
A kind of 3D hybrid assembly structure and technology
Dongmei Li, Xiaocheng Feng, Binhao Lian, Quanbin Yao
Published in 2013 14th International Conference on Electronic Packaging Technology (01.08.2013)
Published in 2013 14th International Conference on Electronic Packaging Technology (01.08.2013)
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Conference Proceeding
Reliability study of the solder joints in CCGA package during thermal test
Xiaorui Lv, Yingzhuo Huang, Pengrong Lin, Xueming Jiang, Binhao Lian, Quanbin Yao
Published in 2014 15th International Conference on Electronic Packaging Technology (01.05.2014)
Published in 2014 15th International Conference on Electronic Packaging Technology (01.05.2014)
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Conference Proceeding
Effect of temperature cycling on reliability of flip chip solder joint
Xueming Jiang, Pengrong Lin, Yuezhong Song, Yingzhuo Huang, Binhao Lian, Quanbin Yao
Published in 2014 15th International Conference on Electronic Packaging Technology (01.05.2014)
Published in 2014 15th International Conference on Electronic Packaging Technology (01.05.2014)
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Conference Proceeding
Extraction of electrical model for CBGA500
Xie Wenjun, Cao Yusheng, Yao Quanbin
Published in 2011 International Symposium on Advanced Packaging Materials (APM) (01.10.2011)
Published in 2011 International Symposium on Advanced Packaging Materials (APM) (01.10.2011)
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Conference Proceeding
The effect of palladium addition to the 63Sn37Pb solder on the process of the CCGA package
Yingzhuo Huang, Pengrong Lin, Yusheng Cao, Quanbin Yao
Published in 2011 International Symposium on Advanced Packaging Materials (APM) (01.10.2011)
Published in 2011 International Symposium on Advanced Packaging Materials (APM) (01.10.2011)
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Conference Proceeding
Research on the rework process of the ceramic ball grid array package
Yingzhuo Huang, Bo Huang, Pengrong Lin, Yusheng Cao, Binhao Lian, Quanbin Yao
Published in 2013 14th International Conference on Electronic Packaging Technology (01.08.2013)
Published in 2013 14th International Conference on Electronic Packaging Technology (01.08.2013)
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Conference Proceeding
Electrical simulation research for IC package gold bonding wire
Cao Yusheng, Du Shuan, Yao Quanbin, Zhao Yuanfu
Published in 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (01.08.2010)
Published in 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (01.08.2010)
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Conference Proceeding