Suppressing the filament formation by aluminum doping in anatase titanium oxide
Chung, Chih-Hung, Lin, Chiung-Yuan, Yang, Tsung-Fu, Huang, Hsin-Hui, Hou, Tuo-Hung, Magyari-Köpe, Blanka
Published in AIP advances (01.12.2022)
Published in AIP advances (01.12.2022)
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Journal Article
Development of Cu/Ni/SnAg Microbump Bonding Processes for Thin Chip-on-Chip Packages Via Wafer-Level Underfill Film
LEE, Chang-Chun, YANG, Tsung-Fu, KAO, Kuo-Shu, CHENG, Ren-Chin, ZHAN, Chau-Jie, CHEN, Tai-Hong
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.09.2012)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.09.2012)
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Journal Article
Influence of underfill materials on the reliability of coreless flip chip package
Chuang, Chun-Chih, Yang, Tsung-Fu, Juang, Jin-Ye, Hung, Yin-Po, Zhan, Chau-Jie, Lin, Yu-Min, Lin, Ching-Tsung, Chang, Pei-Chen, Chang, Tao-Chih
Published in Microelectronics and reliability (01.11.2008)
Published in Microelectronics and reliability (01.11.2008)
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Journal Article
Evaluation of Cu/Ni/SnAg microbump bonding processes for thin-chip-on-chip package using a wafer-level underfill film
Chang-Chun Lee, Tsung-Fu Yang, Kuo-Shu Kao, Ren-Chin Cheng, Chau-Jie Zhan, Tai-Hong Chen
Published in 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (01.05.2012)
Published in 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (01.05.2012)
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Conference Proceeding
Reliability estimation and failure mode prediction for 3D chip stacking package with the application of wafer-level underfill
Lee, Chang-Chun, Yang, Tsung-Fu, Wu, Chih-Sheng, Kao, Kuo-Shu, Cheng, Ren-Chin, Chen, Tai-Hong
Published in Microelectronic engineering (01.07.2013)
Published in Microelectronic engineering (01.07.2013)
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Conference Proceeding
Synthesis of Novel Biodegradable Cationic Polymer: N,N-Diethylethylenediamine Polyurethane as a Gene Carrier
Yang, Tsung-fu, Chin, Wei-kuo, Cherng, Jong-yuh, Shau, Min-da
Published in Biomacromolecules (01.09.2004)
Published in Biomacromolecules (01.09.2004)
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Journal Article
Assembly process and reliability assessment of TSV/RDL/IPD interposer with multi-chip-stacking for 3D IC integration SiP
Chau-Jie Zhan, Pei-Jer Tzeng, Lau, J. H., Ming-Ji Dai, Heng-Chieh Chien, Ching-Kuan Lee, Shang-Tsai Wu, Kuo-Shu Kao, Shin-Yi Huang, Chia-Wen Fan, Su-Ching Chung, Yu-Wei Huang, Yu-Min Lin, Jing-Yao Chang, Tsung-Fu Yang, Tai-Hung Chen, Lo, R., Kao, M. J.
Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01.05.2012)
Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01.05.2012)
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Conference Proceeding
Effects of UBM structure/material on the reliability performance of 3D chip stacking with 30μm-pitch solder micro bump interconnections
Shin-Yi Huang, Chau-Jie Zhan, Yu-Wei Huang, Yu-Min Lin, Chia-Wen Fan, Su-Ching Chung, Kuo-Shu Kao, Jing-Yao Chang, Mei-Lun Wu, Tsung-Fu Yang, Lau, J. H., Tai-Hung Chen
Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01.05.2012)
Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01.05.2012)
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Conference Proceeding
Assembly analysis of Cu/Ni/SnAg microbump for stacking thin chips in a fine pitch package using a wafer-level underfill
Chang-Chun Lee, Tsung-Fu Yang, Kuo-Shu Kao, Ren-Chin Cheng, Chau-Jie Zhan
Published in 2012 14th International Conference on Electronic Materials and Packaging (EMAP) (01.12.2012)
Published in 2012 14th International Conference on Electronic Materials and Packaging (EMAP) (01.12.2012)
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Conference Proceeding
Achievement of low temperature chip stacking by a wafer-applied underfill material
Ren-Shin Cheng, Kuo-Shu Kao, Jing-Yao Chang, Yin-Po Hung, Tsung-Fu Yang, Yu-Wei Huang, Su-Mei Chen, Tao-Chih Chang, Qiaohong Huang, Guino, R., Hoang, G., Jie Bai, Becker, K.
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
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Conference Proceeding
Low temperature bonding using non-conductive adhesive for 3D chip stacking with 30μm-pitch micro solder bump interconnections
Yu-Min Lin, Chau-Jie Zhan, Kuo-Shu Kao, Chia-Wen Fan, Su-Ching Chung, Yu-Wei Huang, Shin-Yi Huang, Jing-Yao Chang, Tsung-Fu Yang, Lau, J. H., Tai-Hung Chen
Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01.05.2012)
Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01.05.2012)
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Conference Proceeding
Fine Pitch Compliant Bump Interconnection for Flip chip on Flexible Display Packaging by Anisotropic Conductive Film
Yao-Sheng Lin, Tsung-Fu Yang, Wen-Chi Chen, Tai-Hung Chen, Chun-Cheng Cheng, Yung-Hui Yeh
Published in 2007 Proceedings 57th Electronic Components and Technology Conference (01.05.2007)
Published in 2007 Proceedings 57th Electronic Components and Technology Conference (01.05.2007)
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Conference Proceeding
A scheme of array memory stacking to the multi-channel solid state disk (SSD) applications: High speed, high reliability, and green compliance
Li-Cheng Shen, Wen-Chih Chen, Yin-Po Hung, Tsung-Fu Yang, Fang-Jim Leu, Tao-Chih Chang
Published in 2008 58th Electronic Components and Technology Conference (01.05.2008)
Published in 2008 58th Electronic Components and Technology Conference (01.05.2008)
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Conference Proceeding
Chip Embedded Wafer Level Packaging Technology for Stacked RF-SiP Application
Chien-Wei Chien, Li-Cheng Shen, Tao-Chih Chang, Chin-Yao Chang, Fang-Jun Leu, Tsung-Fu Yang, Cheng-Ta Ko, Ching-Kuan Lee, Chao-Kai Shu, Yuan-Chang Lee, Ying-Ching Shih
Published in 2007 Proceedings 57th Electronic Components and Technology Conference (01.05.2007)
Published in 2007 Proceedings 57th Electronic Components and Technology Conference (01.05.2007)
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Conference Proceeding
Wafer level chip stacked module by embedded IC packaging technology
Chien-Wei Chien, Li-Cheng Shen, Tao-Chih Chang, Chin-Yao Chang, Fang-Jun Leu, Tsung-Fu Yang, Cheng-Ta Ko, Ching-Kuan Lee, Chao-Kai Shu, Yuan-Chang Lee, Ying-Ching Shih
Published in 2007 International Microsystems, Packaging, Assembly and Circuits Technology (01.10.2007)
Published in 2007 International Microsystems, Packaging, Assembly and Circuits Technology (01.10.2007)
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Conference Proceeding
Thermal and Electrical Performance Enhancement with a Cost-Effective Packaging for High Speed Memory Chips
Li-Cheng Shen, Chien-Wei Chien, Tao-Chih Chang, Tsung-Fu Yang, Wen-Chih Chen, Yin-Po Hung, Cheng-Ta Ko, Yuan-Chang Lee, Ying-Ching Shih, Wei, I., Lei, C.
Published in 2007 Proceedings 57th Electronic Components and Technology Conference (01.05.2007)
Published in 2007 Proceedings 57th Electronic Components and Technology Conference (01.05.2007)
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Conference Proceeding
From Diagnosis to Realization of Virtual Choiring System: On the Way to the Creation of an Immersive and Versatile Practicing and Performing Platform based on New-Generation Communication Technologies
Chen, Ching-Mao, Lee, Chia-Jen, Lin, Chiung-Yuan, Yang, Tsung-Fu, Chen, Sau-Gee
Published in International Journal of Social Sciences and Artistic Innovations (30.09.2021)
Published in International Journal of Social Sciences and Artistic Innovations (30.09.2021)
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Journal Article
Development of fluxless chip-on-wafer bonding process for 3DIC chip stacking with 30μm pitch lead-free solder micro bumps and reliability characterization
Chau-Jie Zhan, Jing-Ye Juang, Yu-Min Lin, Yu-Wei Huang, Kuo-Shu Kao, Tsung-Fu Yang, Su-Tsai Lu, Lau, John H., Tai-Hong Chen, Lo, Robert, Kao, M. J.
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
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Conference Proceeding