by Yang, Penny H W, Black, Jennifer L, Barr, Susan I, Vatanparast, Hassanali
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by Bacon, Elizabeth, An, Lawrence, Yang, Penny, Hawley, Sarah, Van Horn, M Lee, Resnicow, Ken
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by Hou, Chun-Ming, Hou, Chen-Pang, Tsui, Ke-Hung, Chang, Phei-Lang, Chen, Chien-Lun, Lin, Yu-Hsiang, Pei-Shan Yang, Penny
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by Lai, Wei-Hong, Yang, Penny, Hu, Ian, Liao, Tse-Wei, Chen, KarenYU, Tarng, David, Hung, CP
Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01.06.2020)

by Chen, Hsin-En, Yang, Penny, Hu, Ian, Shih, Meng-Kai, Tarng, David, Hung, C.P.
Published in 2019 20th International Conference on Electronic Packaging Technology(ICEPT) (01.08.2019)

by Tang-Yuan Chen, Bo-Syun Chen, Yang, Penny, Jin-Yuan Lai, MengKai Shih
Published in 2016 IEEE CPMT Symposium Japan (ICSJ) (01.11.2016)

by Wang, James, Ding, Y C, Lia Liao, Yang, Penny, Yi-shao Lai, Tseng, Andy
Published in 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (01.08.2010)