by Jiang, Wen-Juan, Peng, Yun-Chuan, Yang, Kai-Ming
Published in Experimental and therapeutic medicine (01.10.2018)

by Wen, Jin‐song, Yang, Ming‐kai, Fan, De‐jun
Published in Advances in polymer technology (01.12.2018)

by Lee, Tzu-Nien, Lau, John-H, Ko, Cheng-Ta, Xia, Tim, Lin, Eagle, Yang, Kai-Ming, Lin, Puru-Bruce, Peng, Chia-Yu, Chang, Leo, Chen, Jia-Shiang, Fang, Yi-Hsiu, Liao, Li-Yueh, Charn, Edward, Wang, Jason, Tseng, Tzyy-Jang
Published in Materials (24.03.2022)

by Wen, Jin-song, Huang, Zhi-gao, Yang, Ming-kai, Fan, De-jun
Published in Advances in polymer technology (01.01.2019)

by Chou, Tzu-Chieh, Yang, Kai-Ming, Li, Jian-Chen, Yu, Ting-Yang, Yang, Yu-Tao, Hu, Han-Wen, Liu, Yu-Wei, Ko, Cheng-Ta, Chen, Yu-Hua, Tseng, Tzyy-Jang, Chen, Kuan-Neng
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.08.2020)

by Wu, Han-Lin, Hsu, Po-Cheng, Hsu, Sanford P C, Lin, Chun-Fu, Liao, Kwong-Kum, Yang, Kai-Ming, Chou, Chen-Liang, Yang, Tsui-Fen
Published in Ci ji yi xue za zhi (01.10.2021)

by Yang, Yu-Tao, Chou, Tzu-Chieh, Yu, Ting-Yang, Chang, Yu-Wei, Huang, Tai-Yuan, Yang, Kai-Ming, Ko, Cheng-Ta, Chen, Yu-Hua, Tseng, Tzyy-Jang, Chen, Kuan-Neng
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.09.2017)

by Li, Xin, Yang, Kai-ming, Zhu, Yu, Yu, Dong-dong
Published in Journal of mechanical science and technology (01.03.2013)

by Cao, Jian, Guo, Yong-jiang, Yang, Kai-ming
Published in Acta Mathematicae Applicatae Sinica (01.04.2024)

by Li, Shao-Ting, Suen, Wei-Jeng, Kao, Cheng-Heng, Yang, Ming-Kai, Yang, Liang-Tung
Published in Journal of investigative dermatology (01.11.2020)

by Wang, Qi-Ming, Zhang, Ye, Yang, Kai-Ming, Zhou, Hong-Ying, Yang, Hui-Jun
Published in World journal of gastroenterology : WJG (28.04.2006)

by Yang, Kai-Ming, Zhang, Meng, Li, Yi-Xiang, Huang, Liang-Zhu, Zhao, Yu, Yang, Hua, Bai, Yu-Bin
Published in Zeitschrift für Kristallographie. New crystal structures (27.08.2024)

by Lau, John H., Ko, Cheng-Ta, Yang, Kai-Ming, Peng, Chia-Yu, Xia, Tim, Lin, Puru Bruce, Chen, J. J., Huang, Patrick Po-Chun, Liu, Hsing-Ning, Tseng, Tzyy-Jang, Lin, Eagle, Chang, Leo
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.07.2020)

by Lau, John H., Lin, Curry, Liu, Hsing-Ning, Yang, Kai-Ming, Xia, Tim, Ko, Cheng-Ta, Lin, Bruce Puru, Chuang, Yu-Ling, Chen, R., Ma, M., Tseng, Tzyy-Jang, Li, Ming, Leung, K.
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.09.2023)

by Lau, John H., Ko, Cheng-Ta, Lin, Curry, Tseng, Tzvy-Jang, Yang, Kai-Ming, Xia, Tim, Lin, Puru Bruce, Peng, Chia-Yu, Lin, Eagle, Chang, Leo, Liu, Ning, Chiu, Show May, Lee, Tzu Nien
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.05.2021)

by Peng, Tony Chia-Yu, Lau, John H., Ko, Cheng-Ta, Lee, Paul, Lin, Eagle, Yang, Kai-Ming, Lin, Bruce Puru, Xia, Tim, Chang, Leo, Liu, Hsing-Ning, Lin, Curry, Lee, Tzu Nien, Wong, Jason, Ma, Mike, Tseng, Tzyy-Jang
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.03.2022)

by Yang, Kai-Ming, Chung, Jen-Yang, Hsieh, Ming-Feng, Lin, Deng-Sung
Published in Japanese Journal of Applied Physics (01.07.2007)

by Lau, John H., Ko, Cheng-Ta, Tseng, Tzyy-Jang, Yang, Kai-Ming, Peng, Tony Chia-Yu, Xia, Tim, Lin, Puru Bruce, Lin, Eagle, Chang, Leo, Liu, Hsing Ning, Cheng, David
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.07.2020)

by Lau, John H., Ko, Cheng-Ta, Peng, Chia-Yu, Yang, Kai-Ming, Xia, Tim, Lin, Puru Bruce, Chen, Jean-Jou, Huang, Po-Chun, Tseng, Tzvy-Jang, Lin, Eagle, Chang, Leo, Lin, Curry, Lu, Winnie
Published in Journal of microelectronics and electronic packaging (01.07.2020)

by Lau, John H, Ko, Cheng-Ta, Peng, Chia-Yu, Yang, Kai-Ming, Xia, Tim, Lin, Puru Bruce, Chen, Jean-Jou, Huang, Po-Chun, Tseng, Tzvy-Jang, Lin, Eagle, Chang, Leo, Lin, Curry, Fan, Yan-Jun, Liu, Hsing-Ning, Lu, Winnie
Published in Journal of microelectronics and electronic packaging (01.04.2021)