Effects of diamond size of CMP conditioner on wafer removal rates and defects for solid (non-porous) CMP pad with micro-holes
Chul Yang, Ji, Hoon Choi, Joo, Hwang, Taewook, Lee, Chil-Gee, Kim, Taesung
Published in International journal of machine tools & manufacture (01.10.2010)
Published in International journal of machine tools & manufacture (01.10.2010)
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Journal Article
Post Cleaning for FEOL CMP with Silica and Ceria Slurries
Tseng, Wei-Tsu, Jha, Amarnath, Stoll, Derek, Wu, Changhong, McCormack, Tim, Yang, JI Chul
Published in ECS transactions (01.01.2017)
Published in ECS transactions (01.01.2017)
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Journal Article
Step height removal mechanism of chemical mechanical planarization (CMP) for sub-nano-surface finish
Yang, Ji Chul, Oh, Dong Won, Lee, Gae Won, Song, Chang Lyung, Kim, Taesung
Published in Wear (04.02.2010)
Published in Wear (04.02.2010)
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Journal Article
Investigation on Surface Hardening of Polyurethane Pads During Chemical Mechanical Polishing (CMP)
JI CHUL YANG, DONG WON OH, HO JOONG KIM, KIM, Taesung
Published in Journal of electronic materials (01.03.2010)
Published in Journal of electronic materials (01.03.2010)
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Journal Article
Investigation on the control of silicon whisker generation during dichlorosilane-based WSi deposition process
Choi, Hoomi, Oh, Myeonghun, Kim, Jinsung, Kim, Jaungjoo, Yang, Ji Chul, Lee, Soochul, Lee, Sang Won, Kim, Taesung
Published in Thin solid films (30.10.2012)
Published in Thin solid films (30.10.2012)
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Journal Article
Conference Proceeding
Challenges in Chemical Mechanical Planarization defects of 7nm device and its improvement opportunities
Ji Chul Yang, Penigalapati, Dinesh, Tai Fong Chao, Wen Yin Lu, Koli, Dinesh
Published in 2017 China Semiconductor Technology International Conference (CSTIC) (01.03.2017)
Published in 2017 China Semiconductor Technology International Conference (CSTIC) (01.03.2017)
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Conference Proceeding
Post Cleaning for FEOL CMP with Silica and Ceria Slurries
Tseng, Wei-Tsu, Wu, Changhong, McCormack, Tim, Yang, Ji Chul
Published in ECS journal of solid state science and technology (01.01.2017)
Published in ECS journal of solid state science and technology (01.01.2017)
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Journal Article
Investigation on Surface Hardening of Polyurethane Pads During Chemical Mechanical Polishing (CMP)
Yang, Ji Chul, Oh, Dong Won, Kim, Ho Joong, Kim, Taesung
Published in Journal of electronic materials (01.03.2010)
Published in Journal of electronic materials (01.03.2010)
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Journal Article
Study of sol-gel type ceria particle for CMP process in leading-edge CMOS device: YE: Yield enhancement/learning
Penigalapati, Dinesh Kumar, Yang, Ji Chul, Jha, Amarnath, Chao, Tai Fong, Koli, Dinesh
Published in 2017 28th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) (01.05.2017)
Published in 2017 28th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) (01.05.2017)
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Conference Proceeding
Optimization of CMP Pad Surface by Laser Induced Micro Hole
Yang, Ji Chul, Kim, Hojoong, Lee, Chil-Gee, Lee, Hyeon-Deok, Kim, Taesung
Published in Journal of the Electrochemical Society (2011)
Published in Journal of the Electrochemical Society (2011)
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Journal Article
Effects of Ceria Abrasive Particle Size Distribution below Wafer Surface on In-Wafer Uniformity during Chemical Mechanical Polishing Processing
Kim, Hojoong, Yang, Ji Chul, Kim, Myungjoon, Oh, Dong-won, Lee, Chil-Gee, Kim, Sang-Yong, Kim, Taesung
Published in Journal of the Electrochemical Society (2011)
Published in Journal of the Electrochemical Society (2011)
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Journal Article
Frictional Characteristic of Polymeric Additive for the Slurry of Chemical Mechanical Planarization Process
Kim, Hojoong, Yang, Ji Chul, Lee, Junwye, Park, Sung Ha, Won, Jehyung, Kim, Mingu, Kim, Taesung
Published in ECS journal of solid state science and technology (01.01.2012)
Published in ECS journal of solid state science and technology (01.01.2012)
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Journal Article
Micro/nano-tribological characteristics of self-assembled monolayer and its application in nano-structure fabrication
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Conference Proceeding
Journal Article
Effective surface design for reduced scratches on CMP
Yang, Ji Chul, Scheffler, Daniel, Moon, Yong Sik
Published in Proceedings of International Conference on Planarization/CMP Technology 2014 (01.11.2014)
Published in Proceedings of International Conference on Planarization/CMP Technology 2014 (01.11.2014)
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Conference Proceeding
Investigation on cu height process control method in BEOL Cu CMP
Ji Chul Yang, Scheffler, Daniel, Yocum, Gerett, Mazzotti, Jason, Dougherty, Mark
Published in 2015 International Conference on Planarization/CMP Technology (ICPT) (01.09.2015)
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Published in 2015 International Conference on Planarization/CMP Technology (ICPT) (01.09.2015)
Conference Proceeding