Spinal cord stimulation for neuropathic pain following idiopathic transverse myelitis - A case report
Lee, Cheong, Cho, Jung-Ha, Yang, Heon Ju, Lee, Jong Hyuk, Woo, Sung Chang, Kim, Young Ju, Park, Dong Ho, Chung, Ji Hyun
Published in Korean journal of anesthesiology (2009)
Published in Korean journal of anesthesiology (2009)
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Journal Article
The effect of bonding conditions on the electrical properties of solder joints fabricated by mechanical caulking using reflowed Sn bumps
Ju-heon Yang, Young-Ho Kim, Jae-Seung Moon, Won-Jong Lee
Published in 2007 International Conference on Electronic Materials and Packaging (01.11.2007)
Published in 2007 International Conference on Electronic Materials and Packaging (01.11.2007)
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Conference Proceeding
Chip-To-Chip Interconnection by Mechanical Caulking Using Reflowed Sn Bumps
Ju-Heon Yang, Young-Ho Kim, Jae-Seung Moon, Won-Jong Lee
Published in 2007 8th International Conference on Electronic Packaging Technology (01.08.2007)
Published in 2007 8th International Conference on Electronic Packaging Technology (01.08.2007)
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Conference Proceeding
PACKAGING DEVICE INCLUDING BUMPS AND METHOD OF MANUFACTURING THE SAME
LEE, Jae Jun, KIM, Jong Yeon, KIM, Jong Hoon, YANG, Ju Heon, LEE, Mi Seon
Year of Publication 28.03.2024
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Year of Publication 28.03.2024
Patent
Spinal cord stimulation for neuropathic pain following idiopathic transverse myelitis: A case report
Lee, Cheong, Cho, Jung Ha, Yang, Heon Ju, Lee, Jong Hyuk, Woo, Sung Chang, Kim, Young Ju, Park, Dong Ho, Chung, Ji Hyun
Published in Korean journal of anesthesiology (01.03.2009)
Published in Korean journal of anesthesiology (01.03.2009)
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Journal Article
Packaging device including bumps and method of manufacturing the same
KIM, JONG-YEON, YANG, JU-HEON, LEE, MI-SEON, KIM, JONG-HOON, LEE, JAE-JUN
Year of Publication 01.04.2024
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Year of Publication 01.04.2024
Patent