Search Results - "Yang, Fangzu" :: K.UTB vyhledávací portál | TBU Library Retrieval Portal

An Electrochemically Assisted Mechanically Controllable Break Junction Approach for Single Molecule Junction Conductance Measurements

An Electrochemically Assisted Mechanically Controllable Break Junction Approach for Single Molecule Junction Conductance Measurements

by Yang, Yang, Chen, Zhaobin, Liu, Junyang, Lu, Miao, Yang, Dezhi, Yang, Fangzu, Tian, Zhongqun
Published in Nano research (01.12.2011)

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Journal Article

Promising electroplating solution for facile fabrication of Cu quantum point contacts

Promising electroplating solution for facile fabrication of Cu quantum point contacts

by Yang, Yang, Liu, Junyang, Zheng, Jueting, Lu, Miao, Shi, Jia, Hong, Wenjing, Yang, Fangzu, Tian, Zhongqun
Published in Nano research (01.10.2017)

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Journal Article

Synthesis and Characterization of a Novel Dialdehyde and Cyclic Anhydride

Synthesis and Characterization of a Novel Dialdehyde and Cyclic Anhydride

by Wu, Liqiong, Feng, Li, Zhang, Hong, Liu, Qixuan, He, Xumin, Yang, Fangzu, Xia, Haiping
Published in Journal of organic chemistry (04.04.2008)

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Journal Article

Copper Deposition on Au(111) in a Deep Eutectic Solvent: An In Situ STM Study

Copper Deposition on Au(111) in a Deep Eutectic Solvent: An In Situ STM Study

by Tan, Zhuo, Liu, Shuai, Wu, Jiedu, Nan, Ziang, Yang, Fangzu, Zhan, Dongping, Yan, Jiawei, Mao, Bingwei
Published in ChemElectroChem (24.02.2022)

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Journal Article

Synthesis and characterization of stable ruthenabenzenes starting from HCCCH(OH)CCH

Synthesis and characterization of stable ruthenabenzenes starting from HCCCH(OH)CCH

by Zhang, Hong, Feng, Li, Gong, Lei, Wu, Liqiong, He, Guomei, Wen, Tingbin, Yang, Fangzu, Xia, Haiping
Published in Organometallics (07.05.2007)

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Journal Article

Synthesis, Characterization and Electrochemical Properties of Stable Osmabenzenes Containing PPh3 Substituents

Synthesis, Characterization and Electrochemical Properties of Stable Osmabenzenes Containing PPh3 Substituents

by Zhang, Hong, Wu, Liqiong, Lin, Ran, Zhao, Qianyi, He, Guomei, Yang, Fangzu, Wen, Ting Bin, Xia, Haiping
Published in Chemistry : a European journal (01.01.2009)

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Journal Article

Synthesis and Characterization of Stable Ruthenabenzenes Starting from HC⋮CCH(OH)C⋮CH

Synthesis and Characterization of Stable Ruthenabenzenes Starting from HC⋮CCH(OH)C⋮CH

by Zhang, Hong, Feng, Li, Gong, Lei, Wu, Liqiong, He, Guomei, Wen, Tingbin, Yang, Fangzu, Xia, Haiping
Published in Organometallics (07.05.2007)

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Journal Article

Electrodeposition and Structure of Ni-W-B Amorphous Alloy

Electrodeposition and Structure of Ni-W-B Amorphous Alloy

by Gangmin, Cao, Fangzu, Yang, Ling, Huang, Zhenjiang, Niu, Shukai, Xu, Shaomin, Zhou
Published in Transactions of the Institute of Metal Finishing (2001)

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Journal Article

Synthesis, Characterization and Electrochemical Properties of Stable Osmabenzenes Containing PPh 3 Substituents

Synthesis, Characterization and Electrochemical Properties of Stable Osmabenzenes Containing PPh 3 Substituents

by Zhang, Hong, Wu, Liqiong, Lin, Ran, Zhao, Qianyi, He, Guomei, Yang, Fangzu, Wen, Ting Bin, Xia, Haiping
Published in Chemistry : a European journal (23.03.2009)

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Journal Article

Direct electroless nickel plating on silicon surface

Direct electroless nickel plating on silicon surface

by HU, Guanghui
Published in Chinese science bulletin (2004)

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Journal Article

Acid sulfate electronic copper electroplating additive composition and application thereof

Acid sulfate electronic copper electroplating additive composition and application thereof

by YANG FANGZU, WANG ZHAOYUN, YANG JIAQIANG, SUN SHIGANG, JIN LEI
Year of Publication 14.03.2023

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Patent

ACID SULFATE ELECTROPLATING COPPER COMBINATION ADDITIVE FOR DENSE FILLING OF PCB THROUGH HOLE METAL

ACID SULFATE ELECTROPLATING COPPER COMBINATION ADDITIVE FOR DENSE FILLING OF PCB THROUGH HOLE METAL

by YANG, Jiaqiang, TIAN, Zhongqun, ZHAN, Dongping, WANG, Zhaoyun, ZHENG, Anni, JIN, Lei, YANG, Fangzu
Year of Publication 28.12.2023

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Patent

LOW-COPPER-SALT WEAKLY-ALKALINE ELECTRONIC COPPER ELECTROPLATING LIQUID FOR COMPACT COPPER FILLING OF PCB BLIND HOLE, AND ELECTROPLATING METHOD THEREFOR

LOW-COPPER-SALT WEAKLY-ALKALINE ELECTRONIC COPPER ELECTROPLATING LIQUID FOR COMPACT COPPER FILLING OF PCB BLIND HOLE, AND ELECTROPLATING METHOD THEREFOR

by YANG, Jiaqiang, TIAN, Zhongqun, ZHAN, Dongping, WANG, Zhaoyun, ZHENG, Anni, JIN, Lei, YANG, Fangzu
Year of Publication 28.12.2023

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Patent

Acid copper plating solution additive for filling through-silicon-via copper, acid copper plating solution and copper metal filling method of through-silicon-via

Acid copper plating solution additive for filling through-silicon-via copper, acid copper plating solution and copper metal filling method of through-silicon-via

by YANG FANGZU, LIU JUNYANG, WANG ZHAOYUN, YANG JIAQIANG, ZHAN DONGPING, ZHAO JIAOYANG, JIN LEI
Year of Publication 08.08.2023

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Patent

Method, device, equipment and medium for determining concentration of additive in acidic copper plating solution based on ultramicroelectrode

Method, device, equipment and medium for determining concentration of additive in acidic copper plating solution based on ultramicroelectrode

by YANG FANGZU, TIAN ZHONGQUN, ZHAO YI, WANG ZHAOYUN, YANG JIAQIANG, ZHAN DONGPING, JIN LEI
Year of Publication 23.06.2023

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Patent

Electronic electroplating additive composition and application thereof in inhibition of transverse electrodeposition of silver-ferrite interface nickel

Electronic electroplating additive composition and application thereof in inhibition of transverse electrodeposition of silver-ferrite interface nickel

by ZENG XIANGDONG, YANG FANGZU, YANG JIAQIANG, ZHAN DONGPING, WANG MEI, XU GUANG, JIN LEI
Year of Publication 30.05.2023

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Patent

SILVER COLLOID ACTIVATION SOLUTION COMPOSITION FOR CHEMICAL COPPER PLATING METALLIZATION ON SURFACE OF POLYMER AND PREPARATION METHOD FOR SILVER COLLOID ACTIVATION SOLUTION COMPOSITION

SILVER COLLOID ACTIVATION SOLUTION COMPOSITION FOR CHEMICAL COPPER PLATING METALLIZATION ON SURFACE OF POLYMER AND PREPARATION METHOD FOR SILVER COLLOID ACTIVATION SOLUTION COMPOSITION

by YANG, Jiaqiang, TIAN, Zhongqun, ZHAN, Dongping, WANG, Zhaoyun, ZHENG, Anni, YANG, Fangzu, JIN, Lei, LI, Weiqing
Year of Publication 25.01.2024

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Patent

Acid sulfate electronic copper electroplating combined additive for dense filling of PCB through hole metal

Acid sulfate electronic copper electroplating combined additive for dense filling of PCB through hole metal

by YANG FANGZU, TIAN ZHONGQUN, WANG ZHAOYUN, ZHENG ANNI, YANG JIAQIANG, ZHAN DONGPING, JIN LEI
Year of Publication 04.10.2022

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Patent

Low-copper-salt weakly-alkaline electronic copper electroplating liquid for compact copper filling of PCB blind hole and application of low-copper-salt weakly-alkaline electronic copper electroplating liquid

Low-copper-salt weakly-alkaline electronic copper electroplating liquid for compact copper filling of PCB blind hole and application of low-copper-salt weakly-alkaline electronic copper electroplating liquid

by YANG FANGZU, TIAN ZHONGQUN, ZHENG ANNI, WANG ZHAOYUN, YANG JIAQIANG, ZHAN DONGPING, JIN LEI
Year of Publication 04.10.2022

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Patent

Silver colloid activating solution composition for chemical copper plating metallization on surface of polymer and preparation method of silver colloid activating solution composition

Silver colloid activating solution composition for chemical copper plating metallization on surface of polymer and preparation method of silver colloid activating solution composition

by YANG FANGZU, TIAN ZHONGQUN, LI WEIQING, ZHENG ANNI, WANG ZHAOYUN, YANG JIAQIANG, ZHAN DONGPING, JIN LEI
Year of Publication 22.11.2022

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Patent