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Published in Journal of electronic materials (01.11.2003)
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Conference Proceeding
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Trench gap-filling copper by ion beam sputter deposition
Han, Sheng, Lee, Tzu-Li, Yang, Ching-Jung, Shih, Han C.
Published in Materials chemistry and physics (10.05.2006)
Published in Materials chemistry and physics (10.05.2006)
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Fabrication of ordered Ta2O5 nanodots using an anodic aluminum oxide template on Si substrate
Yang, Ching-Jung, Chen, Chih, Wu, Pu-Wei, Shieh, Jia-Min, Wang, Shun-Min, Liang, Shih-Wei
Published in Journal of materials research (01.04.2007)
Published in Journal of materials research (01.04.2007)
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Journal Article
MIM CAPACITOR AND METHOD FORMING THE SAME
LAI YU CHIA, LIANG SHIH WEI, LII MIRNG JI, YANG CHING JUNG, TSAI HAO YI, TU HSIEN MING, HUANG CHANG PIN
Year of Publication 26.09.2016
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Year of Publication 26.09.2016
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