Two new eudesmane-type glucopyranosides from the fruits of Daucus carota L
Xu, Jin-Ke, Lu, Xiang-Hong, Zhu, Wei, Yang, Bing-Xian, Zhang, Lin, Tian, Jing-Kui
Published in Natural product research (18.10.2015)
Published in Natural product research (18.10.2015)
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Journal Article
A new indole alkaloidal glucoside from the aerial parts of Clematis terniflora DC
Li, Wen-Ting, Yang, Bing-Xian, Zhu, Wei, Gong, Ming-Hua, Xu, Xiang-Dong, Lu, Xiang-Hong, Sun, Lian-Li, Tian, Jing-Kui, Zhang, Lin
Published in Natural product research (01.12.2013)
Published in Natural product research (01.12.2013)
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Journal Article
A Comprehensive Simulation Study of Warpage of Fan-out Panel-level Package using Element Birth and Death Technique
Deng, Yun-Kai, Yang, Bing-Xian, Hu, Wei-Lin, Zhang, Xin-Ping
Published in 2021 22nd International Conference on Electronic Packaging Technology (ICEPT) (14.09.2021)
Published in 2021 22nd International Conference on Electronic Packaging Technology (ICEPT) (14.09.2021)
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Conference Proceeding
3D Finite Element Simulation Study of Chip Stacking Structure Considering Different Numbers of Stacked Dies and the Effects of Underfill and Intermetallic Compound Layer of Micro-joints
Yang, Bing-Xian, Fei, Jiu-Bin, Liang, Shui-Bao, Zhou, Min-Bo, Hu, Wei-Lin, Huang, Hai-Jun, Zhang, Xin-Ping
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
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Conference Proceeding
Moisture Desorption and Hygro-Vapor-Thermal Induced Interfacial Delamination in Underfilled FCBGA Package During Reflow Process
Zheng, Long, Deng, Yun-Kai, Wang, Hong-Guang, Lyu, Guang-Chao, Yang, Bing-Xian, Hu, Wei-Lin, Zhang, Xin-Ping
Published in 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) (10.08.2022)
Published in 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) (10.08.2022)
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Conference Proceeding
Interfacial Delamination Characterization and Thermo-mechanical Reliability of Stacked Die Package by Finite Element Analysis
Chen, Bin, Wang, Hong-Guang, Lyu, Guang-Chao, Yang, Bing-Xian, Hu, Wei-Lin, Zhang, Xin-Ping
Published in 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) (10.08.2022)
Published in 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) (10.08.2022)
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Conference Proceeding
A Comprehensive Study of Crack Initiation and Delamination Propagation at the Cu/Polyimide Interface in Fan-out Wafer Level Package during Reflow Process
Wang, Hong-Guang, Lyu, Guang-Chao, Deng, Yun-Kai, Hu, Wei-Lin, Yang, Bing-Xian, Zhou, Min-Bo, Zhang, Xin-Ping
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
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Conference Proceeding
Multiple fault diagnosis of down-hole conditions of sucker-rod pumping wells based on Freeman chain code and DCA
Li, Kun, Gao, Xian-wen, Yang, Wei-bing, Dai, Ying-long, Tian, Zhong-da
Published in Petroleum science (01.09.2013)
Published in Petroleum science (01.09.2013)
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Journal Article
COMBINED EFFECT OF MODIFIED ZEOLITE 13X AND β-NUCLEATING AGENT ON IMPROVING β-CRYSTAL CONTENT AND TOUGHENING POLYPROPYLENE RANDOM COPOLYMER
Leng, Jin-hua, Liu, Heng, He, Bo-bing, Yang, Bin, Chen, Xian, Qin, Qing-quan
Published in Chinese journal of polymer science (01.11.2013)
Published in Chinese journal of polymer science (01.11.2013)
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Journal Article